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Patent applications and USPTO patent grants for Sing; Goh Kok.The latest application filed is for "ground contact of an integrated circuit testing apparatus".
Patent | Date |
---|---|
Ground contact of an integrated circuit testing apparatus Grant 9,658,248 - Kuong , et al. May 23, 2 | 2017-05-23 |
Multiple rigid contact solution for IC testing Grant 9,182,424 - Kuong , et al. November 10, 2 | 2015-11-10 |
Ground Contact Of An Integrated Circuit Testing Apparatus App 20140103952 - KUONG; Foong Wei ;   et al. | 2014-04-17 |
Multiple Rigid Contact Solution For Ic Testing App 20130249583 - KUONG; Foong Wei ;   et al. | 2013-09-26 |
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