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Patent applications and USPTO patent grants for Sinaga; Richard Mangapul.The latest application filed is for "packaging integrated circuits".
Patent | Date |
---|---|
Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame Grant 8,535,986 - Koh , et al. September 17, 2 | 2013-09-17 |
Packaging Integrated Circuits App 20120043650 - Koh; Liang Kng Ian ;   et al. | 2012-02-23 |
Semiconductor package and method Grant 7,635,910 - Sinaga , et al. December 22, 2 | 2009-12-22 |
Semiconductor Package and Method App 20080258274 - Sinaga; Richard Mangapul ;   et al. | 2008-10-23 |
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