Sin; Wha-Su

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sin; Wha-Su.The latest application filed is for "package-on-package semiconductor package having spacers disposed between two package substrates".

Company Profile

0.11.24

Sin; Wha-Su - Chungcheongnam-do KR
SIN; Wha-su - Cheonan-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package and method of manufacturing the semiconductor package Grant 8,115,323 - Sin , et al. February 14, 2	2012-02-14
Package-on-package Semiconductor Package Having Spacers Disposed Between Two Package Substrates App 20120013007 - HWANG; Hyun-ik ; et al.	2012-01-19
Printed circuit board and method thereof and a solder ball land and method thereof Grant 8,039,972 - Jung , et al. October 18, 2	2011-10-18
Wafer Polishing Apparatus For Adjusting Height Of Wheel Tip App 20110124273 - Roh; Jung-Hyun ; et al.	2011-05-26
Wiring Substrate For A Semiconductor Chip And Semiconductor Package Having The Wiring Substrate App 20110024919 - Kang; Tae-Gyu ; et al.	2011-02-03
Method of cutting a wafer Grant 7,863,161 - Chan , et al. January 4, 2	2011-01-04
Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same Grant 7,745,932 - Ko , et al. June 29, 2	2010-06-29
Method of manufacturing semiconductor package using redistribution substrate Grant 7,713,788 - Ko , et al. May 11, 2	2010-05-11
Semiconductor device having pillar-shaped terminal Grant 7,696,615 - Ko , et al. April 13, 2	2010-04-13
Printed circuit board and method thereof and a solder ball land and method thereof App 20090278249 - Jung; Ky-hyun ; et al.	2009-11-12
Printed circuit board and method thereof and a solder ball land and method thereof Grant 7,576,438 - Jung , et al. August 18, 2	2009-08-18
Method Of Manufacturing A Semiconductor Package App 20090200362 - JUNG; Ky-Hyun ; et al.	2009-08-13
Method Of Manufacturing Semiconductor Package Using Redistribution Substrate App 20090053858 - KO; Jun-Young ; et al.	2009-02-26
Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same App 20080315408 - Ko; Jun-young ; et al.	2008-12-25
Method Of Cutting A Wafer App 20080311727 - CHAN; Dae-Sang ; et al.	2008-12-18
Method of processing a semiconductor wafer for manufacture of semiconductor device Grant 7,452,753 - Chun , et al. November 18, 2	2008-11-18
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20080265431 - Sin; Wha-Su ; et al.	2008-10-30
Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the same App 20080251949 - Sin; Wha-Su ; et al.	2008-10-16
Method of forming solder ball, and fabricating method and structure of semiconductor package using the same Grant 7,427,558 - Kim , et al. September 23, 2	2008-09-23
Package stack and manufacturing method thereof Grant 7,420,814 - Kim , et al. September 2, 2	2008-09-02
Wiring Film Having Wire, Semiconductor Package Including The Wiring Film, And Method Of Fabricating The Semiconductor Package App 20080111230 - KIM; Goon-Woo ; et al.	2008-05-15
Cleaning solutions and methods of cleaning boards using the same App 20080110477 - Jung; Ky-Hyun ; et al.	2008-05-15
Fixing Apparatus For Semiconductor Wafer App 20080070382 - CHAN; Dae-Sang ; et al.	2008-03-20
Substrate For Semiconductor Package And Method Of Manufacturing The Same App 20080061434 - JUNG; Ky-Hyun ; et al.	2008-03-13
Mounting Structure Of Semiconductor Device Having Flux And Under Fill Resin Layer And Method Of Mounting Semiconductor Device App 20080042279 - BANG; Hyo-Jae ; et al.	2008-02-21
Semiconductor Chip And Method Of Forming The Same App 20080012096 - SIN; Wha-Su ; et al.	2008-01-17
Semiconductor Device And Method Of Forming The Same App 20080012116 - KO; Jun-Young ; et al.	2008-01-17
Semiconductor package with improved chip attachment and manufacturing method thereof Grant 7,235,887 - Lee , et al. June 26, 2	2007-06-26
Method of fabricating wafer chips App 20070057410 - Chan; Dae-sang ; et al.	2007-03-15
Semiconductor wafer level chip package and method of manufacturing the same App 20070052094 - Kim; Goon-Woo ; et al.	2007-03-08
Package stack and manufacturing method thereof App 20060076665 - Kim; Jae-Hong ; et al.	2006-04-13
Method of forming solder ball, and fabricating method and structure of semiconductor package using the same App 20060057833 - Kim; Jae-Hong ; et al.	2006-03-16
Method of processing a semiconductor wafer for manufacture of semiconductor device App 20060008948 - Chun; Dae-Sang ; et al.	2006-01-12
Apparatus for ejecting relatively thin IC chip from semiconductor wafer App 20060003491 - Kim; Goon-Woo ; et al.	2006-01-05
Semiconductor package with improved chip attachment and manufacturing method thereof App 20050040514 - Lee, Jong-Ung ; et al.	2005-02-24

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