Simpson; Alexander

Patent Applications and Registrations

Patent applications and USPTO patent grants for Simpson; Alexander.The latest application filed is for "wet gas compressor systems".

Company Profile

0.16.18

Simpson; Alexander - Bavaria DE
Simpson; Alexander - Munchen N/A DE
Simpson; Alexander - Munich DE
Simpson; Alexander - Chesire GB
Simpson; Alexander - Glen Allen VA
Simpson; Alexander - Warrenville IL
Simpson; Alexander - Wappingers Falls NY
Simpson; Alexander - Muckhart GB6

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wet gas compressor systems Grant 8,690,519 - Aalburg , et al. April 8, 2	2014-04-08
Method and apparatus for measuring air flow condition at a wind turbine blade Grant 8,408,871 - Herr , et al. April 2, 2	2013-04-02
Wet Gas Compressor Systems App 20120201660 - Aalburg; Christian ; et al.	2012-08-09
System And Method For Waste Heat Recovery In Exhaust Gas Recirculation App 20110209473 - Fritz; Jassin ; et al.	2011-09-01
Wind turbine aerodynamic separation control Grant 8,002,524 - Eggleston , et al. August 23, 2	2011-08-23
Compressed Air Energy Storage System With Reversible Compressor-expander Unit App 20110094212 - Ast; Gabor ; et al.	2011-04-28
Emission System, Apparatus, And Method App 20100146967 - Simpson; Alexander ; et al.	2010-06-17
Emission System, Apparatus, And Method App 20100146968 - Simpson; Alexander ; et al.	2010-06-17
Wind Turbine Aerodynamic Separation Control App 20100143118 - Eggleston; Eric ; et al.	2010-06-10
Method Of Producing Substoichiometric Oxides Of Titanium By Reduction With Hydrogen App 20100040533 - Simpson; Alexander ; et al.	2010-02-18
Method And Apparatus For Measuring Air Flow Condition At A Wind Turbine Blade App 20090311096 - Herr; Stefan ; et al.	2009-12-17
Polishing composition for a tungsten-containing substrate Grant 7,582,127 - Vacassy , et al. September 1, 2	2009-09-01
Method of polishing a tungsten-containing substrate App 20070266641 - Vacassy; Robert ; et al.	2007-11-22
Method Of Polishing A Tungsten-containing Substrate App 20070214728 - Vacassy; Robert ; et al.	2007-09-20
Method of polishing a tungsten-containing substrate Grant 7,247,567 - Vacassy , et al. July 24, 2	2007-07-24
Method of polishing a tungsten-containing substrate App 20050282391 - Vacassy, Robert ; et al.	2005-12-22
Method of determining the endpoint of a planarization process Grant 6,932,674 - Lahnor , et al. August 23, 2	2005-08-23
Chemical mechanical polishing (CMP) process using fixed abrasive pads Grant 6,899,597 - Wrschka , et al. May 31, 2	2005-05-31
Defect-minimizing, topology-independent planarization of process surfaces in semiconductor devices Grant 6,893,968 - Lahnor , et al. May 17, 2	2005-05-17
Chemical mechanical polishing (CMP) process using fixed abrasive pads App 20050014454 - Wrschka, Peter ; et al.	2005-01-20
Method of planarizing substrates Grant 6,827,635 - Lahnor , et al. December 7, 2	2004-12-07
Method Of Planarizing Substrates App 20040185756 - Lahnor, Peter ; et al.	2004-09-23
Method Of Determining The Endpoint Of A Planarization Process App 20040176015 - Lahnor, Peter ; et al.	2004-09-09
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates Grant 6,740,539 - Conti , et al. May 25, 2	2004-05-25
Defect-minimizing, topology-independent planarization of process surfaces in semiconductor devices App 20030190809 - Lahnor, Peter ; et al.	2003-10-09
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates App 20030153198 - Conti, Richard A. ; et al.	2003-08-14
Slurry-less chemical-mechanical polishing Grant 6,569,769 - Economikos , et al. May 27, 2	2003-05-27
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates App 20030017642 - Conti, Richard A. ; et al.	2003-01-23
Method To Increase Removal Rate Of Oxide Using Fixed-abrasive App 20020197937 - Economikos, Laertis ; et al.	2002-12-26
Method to increase removal rate of oxide using fixed-abrasive Grant 6,485,355 - Economikos , et al. November 26, 2	2002-11-26
Increased polish removal rate of dielectric layers using fixed abrasive pads Grant 6,350,692 - Economikos , et al. February 26, 2	2002-02-26
Boring apparatus Grant 5,120,167 - Simpson June 9, 1	1992-06-09

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