Simmons-Matthews; Margaret

Patent Applications and Registrations

Patent applications and USPTO patent grants for Simmons-Matthews; Margaret.The latest application filed is for "die having through-substrate vias with deformation protected tips".

Company Profile

0.10.12

Simmons-Matthews; Margaret - Richardson TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies Grant 8,815,642 - West , et al. August 26, 2	2014-08-26
TCE compensation for package substrates for reduced die warpage assembly Grant 8,759,154 - Simmons-Matthews June 24, 2	2014-06-24
Die Having Through-substrate Vias With Deformation Protected Tips App 20140151895 - WEST; JEFFREY ALAN ; et al.	2014-06-05
Through-silicon Via (tsv) Die And Method To Control Warpage App 20140124900 - WEST; JEFFREY ALAN ; et al.	2014-05-08
Laser-Assisted Cleaving of a Reconstituted Wafer for Stacked Die Assemblies App 20140038359 - West; Jeffrey Alan ; et al.	2014-02-06
Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies Grant 8,575,758 - West , et al. November 5, 2	2013-11-05
Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate Grant 8,471,577 - Stillman , et al. June 25, 2	2013-06-25
Laser-assisted Cleaving Of A Reconstituted Wafer For Stacked Die Assemblies App 20130032946 - WEST; JEFFREY ALAN ; et al.	2013-02-07
TCE Compensation for Package Substrates for Reduced Die Warpage Assembly App 20130029457 - Simmons-Matthews; Margaret	2013-01-31
Through carrier dual side loop-back testing of TSV die after die attach to substrate Grant 8,344,749 - Stillman , et al. January 1, 2	2013-01-01
Warpage control features on the bottomside of TSV die lateral to protruding bottomside tips Grant 8,344,493 - West , et al. January 1, 2	2013-01-01
TCE compensation for package substrates for reduced die warpage assembly Grant 8,298,863 - Simmons-Matthews October 30, 2	2012-10-30
Warpage Control Features On The Bottomside Of Tsv Die Lateral To Protruding Bottomside Tips App 20120175774 - West; Jeffrey Alan ; et al.	2012-07-12
Lateral Coupling Enabled Topside Only Dual-side Testing Of Tsv Die Attached To Package Substrate App 20110304349 - Stillman; Daniel Joseph ; et al.	2011-12-15
Through Carrier Dual Side Loop-back Testing Of Tsv Die After Die Attach To Substrate App 20110298488 - Stillman; Daniel Joseph ; et al.	2011-12-08
Semiconductor wafer with ditched scribe street App 20050266661 - Li, Lei ; et al.	2005-12-01
Semiconductor packages and methods for manufacturing such semiconductor packages Grant 6,768,212 - Karashima , et al. July 27, 2	2004-07-27
Semiconductor packages and methods for manufacturing such semiconductor packages App 20030137033 - Karashima, Akira ; et al.	2003-07-24
Package for printhead chip App 20030090558 - Coyle, Anthony L. ; et al.	2003-05-15

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