Sim; Tangyii
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sim; Tangyii.The latest application filed is for "stretchable member with metal foil".
- Sim; Tangyii - Tokyo JP
- SIM; Tangyii - Chiyoda-ku Tokyo
| Patent | Date |
|---|---|
| Conductor substrate, wiring substrate and method for producing wiring substrate Grant 11,259,409 - Masaki , et al. February 22, 2 | 2022-02-22 |
| Stretchable member with metal foil Grant 10,880,997 - Sim , et al. December 29, 2 | 2020-12-29 |
| Stretchable Member With Metal Foil App 20200154563 - SIM; Tangyii ; et al. | 2020-05-14 |
| Conductor Substrate, Wiring Substrate And Method For Producing Wiring Substrate App 20190320527 - MASAKI; Takeshi ; et al. | 2019-10-17 |
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