Siliconware Precision Industries, Ltd., Taiwan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Siliconware Precision Industries, Ltd., Taiwan.The latest application filed is for "thermally enhanced semicoductor package with emi shielding".
- Siliconware Precision Industries, Ltd., Taiwan -
| Patent | Date |
|---|---|
| Thermally Enhanced Semicoductor Package With Emi Shielding App 20040156172 - Lin, Ying-Ren ; et al. | 2004-08-12 |
| Semiconductor package with chip supporting structure App 20040099931 - Huang, Jung-Pin ; et al. | 2004-05-27 |
| Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same App 20040080031 - Huang, Chien Ping ; et al. | 2004-04-29 |
| Cavity-down ball grid array semiconductor package with heat spreader App 20040070948 - Kao, Nai-Hao ; et al. | 2004-04-15 |
| Warpage preventing substrate App 20040065473 - Chang, Chin-Huang ; et al. | 2004-04-08 |
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