SILICONWARE PRECISION INDUSTRIES
Patent Applications and Registrations
Patent applications and USPTO patent grants for SILICONWARE PRECISION INDUSTRIES.The latest application filed is for "semiconductor package with heat sink".
- SILICONWARE PRECISION INDUSTRIES -
- Siliconware Precision Industries - Taichung TW
| Patent | Date |
|---|---|
| Semiconductor Package With Heat Sink App 20050040519 - Huang, Chien-Ping ; et al. | 2005-02-24 |
| Multi-chip package device with heat sink and fabrication method thereof App 20050035444 - Huang, Chien-Ping | 2005-02-17 |
| Chip carrier and method for testing electrical performance of passive component App 20040190273 - Chen, Chien-Te ; et al. | 2004-09-30 |
| System and method for detecting bonding status of bonding wire of semiconductor package App 20030029901 - Ming-Hsun, Lee ; et al. | 2003-02-13 |
| Semiconductor package with heat-dissipating structure and method of making the same App 20020155640 - Wu, Chi Chuan | 2002-10-24 |
| Layout method for thin and fine ball grid array package substrate with palting bus App 20020058354 - Huang, Chien-Ping ; et al. | 2002-05-16 |
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