Sil; Devika
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sil; Devika.The latest application filed is for "interconnects including dual-metal vias".
- Sil; Devika - Rensselaer NY
| Patent | Date |
|---|---|
| Large grain copper interconnect lines for MRAM Grant 11,309,216 - Reznicek , et al. April 19, 2 | 2022-04-19 |
| Interconnects including dual-metal vias Grant 11,302,637 - Pranatharthi Haran , et al. April 12, 2 | 2022-04-12 |
| Interconnects Including Dual-metal Vias App 20220051976 - Pranatharthi Haran; Balasubramanian S. ; et al. | 2022-02-17 |
| Embedded Metal Contamination Removal from BEOL Wafers App 20210296118 - Sil; Devika ; et al. | 2021-09-23 |
| MRAM devices containing a harden gap fill dielectric material Grant 11,114,606 - Reznicek , et al. September 7, 2 | 2021-09-07 |
| Large Grain Copper Interconnect Lines For Mram App 20210233812 - Reznicek; Alexander ; et al. | 2021-07-29 |
| Interconnect with self-forming wrap-all-around barrier layer Grant 10,978,342 - Huang , et al. April 13, 2 | 2021-04-13 |
| Mram Devices Containing A Harden Gap Fill Dielectric Material App 20210091302 - Reznicek; Alexander ; et al. | 2021-03-25 |
| Ion Implantation Assisted Curing For Flowable Porous Dielectrics App 20200388531 - Sil; Devika ; et al. | 2020-12-10 |
| Bottom-up Curing Of Dielectric Films In Integrated Circuits App 20200388488 - Sil; Devika ; et al. | 2020-12-10 |
| Interconnect with Self-Forming Wrap-All-Around Barrier Layer App 20200243383 - Huang; Huai ; et al. | 2020-07-30 |
| Forming High Carbon Content Flowable Dielectric Film With Low Processing Damage App 20200234949 - Briggs; Benjamin D. ; et al. | 2020-07-23 |
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