Sikka; Kamal K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sikka; Kamal K..The latest application filed is for "fatigue failure resistant eletronic package".
Company Profile
46.81.81
- Sikka; Kamal K. - Poughkeepsie NY
- Sikka; Kamal K. - Hopewell Junction NY
- Sikka; Kamal K - Hopewell Junction NY
- Sikka; Kamal K - Poughkeepsie NY
Patent Activity
| Patent | Date |
|---|---|
| Optimized weight heat spreader for an electronic package Grant 11,410,905 - Sikka , et al. August 9, 2 | 2022-08-09 |
| Fatigue Failure Resistant Eletronic Package App 20220157685 - Sikka; Kamal K. ; et al. | 2022-05-19 |
| Laminated stiffener to control the warpage of electronic chip carriers Grant 11,302,651 - Sikka , et al. April 12, 2 | 2022-04-12 |
| Hybrid TIMs for electronic package cooling Grant 11,264,306 - Sikka , et al. March 1, 2 | 2022-03-01 |
| Direct bonded heterogeneous integration packaging structures Grant 11,177,217 - Sikka , et al. November 16, 2 | 2021-11-16 |
| Multi-chip package structures with discrete redistribution layers Grant 11,164,817 - Rubin , et al. November 2, 2 | 2021-11-02 |
| Mixed under bump metallurgy (UBM) interconnect bridge structure Grant 11,139,269 - Sikka , et al. October 5, 2 | 2021-10-05 |
| Laminated circuitry cooling for inter-chip bridges Grant 11,101,191 - Sikka , et al. August 24, 2 | 2021-08-24 |
| Micro-fluidic channels having various critical dimensions Grant 11,081,424 - Bonam , et al. August 3, 2 | 2021-08-03 |
| Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure App 20210233892 - Sikka; Kamal K. ; et al. | 2021-07-29 |
| Chip Corner Guard For Chip-package Interaction Failure Mitigation App 20210233824 - Li; Shidong ; et al. | 2021-07-29 |
| Semiconductor microcooler Grant 11,056,418 - Canaperi , et al. July 6, 2 | 2021-07-06 |
| Semiconductor microcooler Grant 11,049,789 - Canaperi , et al. June 29, 2 | 2021-06-29 |
| Semiconductor wafer having trenches with varied dimensions for multi-chip modules Grant 11,049,844 - Bonam , et al. June 29, 2 | 2021-06-29 |
| Circuit Substrate With Mixed Pitch Wiring App 20210183753 - Sakuma; Katsuyuki ; et al. | 2021-06-17 |
| Adjustable heat sink fin spacing Grant 11,035,625 - Bodenweber , et al. June 15, 2 | 2021-06-15 |
| Laminated Circuitry Cooling For Inter-chip Bridges App 20210159141 - Sikka; Kamal K. ; et al. | 2021-05-27 |
| Multi-chip Package Structures Formed With Interconnect Bridge Devices And Chip Packages With Discrete Redistribution Layers App 20210134724 - Rubin; Joshua M. ; et al. | 2021-05-06 |
| Multiple chip bridge connector Grant 10,991,635 - McHerron , et al. April 27, 2 | 2021-04-27 |
| Three-dimensional Microelectronic Package With Embedded Cooling Channels App 20210118854 - Sikka; Kamal K. ; et al. | 2021-04-22 |
| Multi integrated circuit chip carrier package Grant 10,978,314 - Interrante , et al. April 13, 2 | 2021-04-13 |
| HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING App 20210098334 - Sikka; Kamal K. ; et al. | 2021-04-01 |
| Adjustable heat sink fin spacing Grant 10,948,247 - Bodenweber , et al. March 16, 2 | 2021-03-16 |
| Three-dimensional microelectronic package with embedded cooling channels Grant 10,937,764 - Sikka , et al. March 2, 2 | 2021-03-02 |
| Cooling structure for electronic boards Grant 10,905,029 - Bodenweber , et al. January 26, 2 | 2021-01-26 |
| Multiple Chip Bridge Connector App 20210020529 - McHerron; Dale Curtis ; et al. | 2021-01-21 |
| Electronic Device Console With Natural Draft Cooling App 20210022239 - SIKKA; Kamal K. ; et al. | 2021-01-21 |
| Semiconductor Wafer Having Trenches With Varied Dimensions For Multi-chip Modules App 20210005573 - Bonam; Ravi K. ; et al. | 2021-01-07 |
| Micro-fluidic Channels Having Various Critical Dimensions App 20200402889 - BONAM; RAVI K. ; et al. | 2020-12-24 |
| Electronic device console with natural draft cooling Grant 10,834,808 - Bodenweber , et al. November 10, 2 | 2020-11-10 |
| Cooling and power delivery for a wafer level computing board Grant 10,825,821 - Khan , et al. November 3, 2 | 2020-11-03 |
| Optimized Weight Heat Spreader For An Electronic Package App 20200303279 - Sikka; Kamal K. ; et al. | 2020-09-24 |
| Three-dimensional Microelectronic Package With Embedded Cooling Channels App 20200294968 - Sikka; Kamal K. ; et al. | 2020-09-17 |
| Cooling structure for electronic boards Grant 10,757,833 - Bodenweber , et al. A | 2020-08-25 |
| Electronic package cover having underside rib Grant 10,665,524 - Sikka , et al. | 2020-05-26 |
| Semiconductor Microcooler App 20200161216 - Canaperi; Donald F. ; et al. | 2020-05-21 |
| Direct Bonded Heterogeneous Integration Packaging Structures App 20200144187 - Sikka; Kamal K. ; et al. | 2020-05-07 |
| Multi Integrated Circuit Chip Carrier Package App 20200135495 - Interrante; Marcus E. ; et al. | 2020-04-30 |
| Integrated Circuit Chip Carrier with In-Plane Thermal Conductance Layer App 20200135701 - Li; Shidong ; et al. | 2020-04-30 |
| Method of forming an electronic package Grant 10,636,746 - Sikka , et al. | 2020-04-28 |
| Semiconductor Microcooler App 20200118904 - Canaperi; Donald F. ; et al. | 2020-04-16 |
| Electronic package cover having underside rib Grant 10,622,275 - Sikka , et al. | 2020-04-14 |
| Reduction of laminate failure in integrated circuit (IC) device carrier Grant 10,607,928 - Call , et al. | 2020-03-31 |
| Lid attach optimization to limit electronic package warpage Grant 10,593,564 - Iruvanti , et al. | 2020-03-17 |
| Adjustable heat sink fin spacing Grant 10,584,924 - Bodenweber , et al. | 2020-03-10 |
| Direct bonded heterogeneous integration packaging structures Grant 10,580,738 - Sikka , et al. | 2020-03-03 |
| Cooling Structure For Electronic Boards App 20200068744 - BODENWEBER; Paul F. ; et al. | 2020-02-27 |
| Integrated Circuit Chip Carrier with In-Plane Thermal Conductance Layer App 20200066680 - Li; Shidong ; et al. | 2020-02-27 |
| Integrated circuit chip carrier with in-plane thermal conductance layer Grant 10,566,313 - Li , et al. Feb | 2020-02-18 |
| Semiconductor Microcooler App 20200051886 - Canaperi; Donald F. ; et al. | 2020-02-13 |
| Semiconductor Microcooler App 20200051896 - Canaperi; Donald F. ; et al. | 2020-02-13 |
| Semiconductor microcooler Grant 10,553,516 - Canaperi , et al. Fe | 2020-02-04 |
| Semiconductor microcooler Grant 10,553,522 - Canaperi , et al. Fe | 2020-02-04 |
| Multi integrated circuit chip carrier package Grant 10,541,156 - Interrante , et al. Ja | 2020-01-21 |
| Cooling structure for electronic boards Grant 10,542,636 - Bodenweber , et al. Ja | 2020-01-21 |
| Laminated Stiffener To Control The Warpage Of Electronic Chip Carriers App 20200013732 - Sikka; Kamal K. ; et al. | 2020-01-09 |
| Copper microcooler structure and fabrication Grant 10,490,480 - Lie , et al. Nov | 2019-11-26 |
| Copper microcooler structure and fabrication Grant 10,490,481 - Lie , et al. Nov | 2019-11-26 |
| Adjustable Heat Sink Fin Spacing App 20190346215 - Bodenweber; Paul F. ; et al. | 2019-11-14 |
| Adjustable Heat Sink Fin Spacing App 20190346214 - Bodenweber; Paul F. ; et al. | 2019-11-14 |
| Cooling Structure For Electronic Boards App 20190335617 - BODENWEBER; Paul F. ; et al. | 2019-10-31 |
| Direct Bonded Heterogeneous Integration Packaging Structures App 20190295952 - Sikka; Kamal K. ; et al. | 2019-09-26 |
| Electronic package with tapered pedestal Grant 10,424,527 - Sikka , et al. Sept | 2019-09-24 |
| Laminated Stiffener To Control The Warpage Of Electronic Chip Carriers App 20190267332 - SIKKA; Kamal K. ; et al. | 2019-08-29 |
| Lid attach optimization to limit electronic package warpage Grant 10,332,813 - Iruvanti , et al. | 2019-06-25 |
| Electronic Package With Tapered Pedestal App 20190148260 - Sikka; Kamal K. ; et al. | 2019-05-16 |
| Cooling structure for electronic boards Grant 10,172,258 - Bodenweber , et al. J | 2019-01-01 |
| Cooling Structure For Electronic Boards App 20180338390 - BODENWEBER; Paul F. ; et al. | 2018-11-22 |
| Adjustable heat sink fin spacing Grant 10,088,244 - Bodenweber , et al. October 2, 2 | 2018-10-02 |
| Lid attach optimization to limit electronic package warpage Grant 10,083,886 - Iruvanti , et al. September 25, 2 | 2018-09-25 |
| Lid Attach Optimization To Limit Electronic Package Warpage App 20180233381 - Iruvanti; Sushumna ; et al. | 2018-08-16 |
| Lid attach optimization to limit electronic package warpage Grant 10,049,896 - Iruvanti , et al. August 14, 2 | 2018-08-14 |
| Lid attach optimization to limit electronic package warpage Grant 9,947,603 - Iruvanti , et al. April 17, 2 | 2018-04-17 |
| Electronic Package Cover Having Underside Rib App 20180082922 - Sikka; Kamal K. ; et al. | 2018-03-22 |
| Electronic Package Cover Having Underside Rib App 20180082919 - Sikka; Kamal K. ; et al. | 2018-03-22 |
| Adjustable heat sink fin spacing Grant 9,921,008 - Bodenweber , et al. March 20, 2 | 2018-03-20 |
| Adjustable Heat Sink Fin Spacing App 20180073818 - Bodenweber; Paul F. ; et al. | 2018-03-15 |
| Lid Attach Optimization To Limit Electronic Package Warpage App 20180068917 - Iruvanti; Sushumna ; et al. | 2018-03-08 |
| Lid Attach Optimization To Limit Electronic Package Warpage App 20180068916 - Iruvanti; Sushumna ; et al. | 2018-03-08 |
| Adjustable Heat Sink Fin Spacing App 20180051940 - Bodenweber; Paul F. ; et al. | 2018-02-22 |
| Electronic package cover having underside rib Grant 9,837,333 - Sikka , et al. December 5, 2 | 2017-12-05 |
| Adjustable Heat Sink Fin Spacing App 20170299281 - Bodenweber; Paul F. ; et al. | 2017-10-19 |
| Adjustable heat sink fin spacing Grant 9,735,083 - Bodenweber , et al. August 15, 2 | 2017-08-15 |
| Cooling structure for electronic boards Grant 9,721,870 - Bodenweber , et al. August 1, 2 | 2017-08-01 |
| Cooling Structure For Electronic Boards App 20170196119 - BODENWEBER; Paul F. ; et al. | 2017-07-06 |
| Cooling And Power Delivery For A Wafer Level Computing Board App 20170178986 - Khan; Babar A. ; et al. | 2017-06-22 |
| Lid Attach Optimization To Limit Electronic Package Warpage App 20170170086 - Iruvanti; Sushumna ; et al. | 2017-06-15 |
| Lid Attach Optimization To Limit Electronic Package Warpage App 20170170030 - Iruvanti; Sushumna ; et al. | 2017-06-15 |
| Heat spreading layer with high thermal conductivity Grant 9,437,515 - Colgan , et al. September 6, 2 | 2016-09-06 |
| Thermal hot spot cooling for semiconductor devices Grant 9,401,315 - Bodenweber , et al. July 26, 2 | 2016-07-26 |
| Determining magnitude of compressive loading Grant 9,366,591 - Bodenweber , et al. June 14, 2 | 2016-06-14 |
| Cooling Structure For Electronic Boards App 20160165755 - BODENWEBER; Paul F. ; et al. | 2016-06-09 |
| Electronic Device Console With Natural Draft Cooling App 20160021731 - BODENWEBER; Paul F. ; et al. | 2016-01-21 |
| Electronic device console with natural draft cooling Grant 9,226,426 - Bodenweber , et al. December 29, 2 | 2015-12-29 |
| Heat Spreading Layer With High Thermal Conductivity App 20150371919 - Colgan; Evan G. ; et al. | 2015-12-24 |
| Heat Spreading Layer With High Thermal Conductivity App 20150371917 - Colgan; Evan G. ; et al. | 2015-12-24 |
| Heat Spreading Layer With High Thermal Conductivity App 20150371918 - Colgan; Evan G. ; et al. | 2015-12-24 |
| Heat Spreading Layer With High Thermal Conductivity App 20150373880 - Colgan; Evan G. ; et al. | 2015-12-24 |
| Heat Spreading Layer With High Thermal Conductivity App 20150373879 - Colgan; Evan G. ; et al. | 2015-12-24 |
| Heat Spreading Layer With High Thermal Conductivity App 20150371922 - Colgan; Evan G. ; et al. | 2015-12-24 |
| Multichip electronic packages and methods of manufacture Grant 9,087,834 - Kadakia , et al. July 21, 2 | 2015-07-21 |
| Multichip module with stiffening frame and associated covers Grant 9,089,051 - Li , et al. July 21, 2 | 2015-07-21 |
| Multichip module with stiffening frame and associated covers Grant 9,089,052 - Li , et al. July 21, 2 | 2015-07-21 |
| Multichip Module With Stiffening Frame And Associated Covers App 20150077944 - Li; Shidong ; et al. | 2015-03-19 |
| Multichip Module With Stiffing Frame And Associated Covers App 20150001701 - Li; Shidong ; et al. | 2015-01-01 |
| Multichip electronic packages and methods of manufacture Grant 8,906,809 - Beaumier , et al. December 9, 2 | 2014-12-09 |
| Multichip electronic packages and methods of manufacture Grant 8,900,927 - Beaumier , et al. December 2, 2 | 2014-12-02 |
| Determining Magnitude Of Compressive Loading App 20140331792 - Bodenweber; Paul F. ; et al. | 2014-11-13 |
| Multichip electronic packages and methods of manufacture Grant 8,860,206 - Sikka , et al. October 14, 2 | 2014-10-14 |
| Heat Spreading Layer With High Thermal Conductivity App 20140284040 - Colgan; Evan G. ; et al. | 2014-09-25 |
| Determining thermal interface material (TIM) thickness change Grant 8,717,043 - Bodenweber , et al. May 6, 2 | 2014-05-06 |
| Multichip Electronic Packages And Methods Of Manufacture App 20140051211 - KADAKIA; Suresh D. ; et al. | 2014-02-20 |
| Multichip Electronic Packages And Methods Of Manufacture App 20140027898 - SIKKA; Kamal K. ; et al. | 2014-01-30 |
| Electronic Device Console With Natural Draft Cooling App 20140024465 - BODENWEBER; Paul F. ; et al. | 2014-01-23 |
| Multichip electronic packages and methods of manufacture Grant 8,592,970 - Sikka , et al. November 26, 2 | 2013-11-26 |
| Multichip electronic packages and methods of manufacture Grant 8,587,114 - Kadakia , et al. November 19, 2 | 2013-11-19 |
| Multichip electronic packages and methods of manufacture Grant 8,445,331 - Kadakia , et al. May 21, 2 | 2013-05-21 |
| Determining Thermal Interface Material (tim) Thickness Change App 20130027063 - BODENWEBER; PAUL F. ; et al. | 2013-01-31 |
| Multichip Electronic Packages And Methods Of Manufacture App 20120326294 - SIKKA; KAMAL K. ; et al. | 2012-12-27 |
| Enhanced thermal management of 3-D stacked die packaging Grant 8,299,608 - Bartley , et al. October 30, 2 | 2012-10-30 |
| Multichip Electronic Packages And Methods Of Manufacture App 20120241944 - BEAUMIER; Martin M. ; et al. | 2012-09-27 |
| Multichip Electronic Packages And Methods Of Manufacture App 20120196408 - KADAKIA; Suresh D. ; et al. | 2012-08-02 |
| Reliability enhancement of metal thermal interface Grant 8,232,636 - Humenik , et al. July 31, 2 | 2012-07-31 |
| Multichip Electronic Packages And Methods Of Manufacture App 20120080784 - KADAKIA; SURESH D. ; et al. | 2012-04-05 |
| Multichip Electronic Packages And Methods Of Manufacture App 20120039046 - BEAUMIER; Martin M. ; et al. | 2012-02-16 |
| Enhanced Thermal Management Of 3-d Stacked Die Packaging App 20120007229 - Bartley; Gerald K. ; et al. | 2012-01-12 |
| Method of forming a flip-chip package Grant 8,037,594 - Coffin , et al. October 18, 2 | 2011-10-18 |
| Microjet module assembly Grant 7,992,627 - Bezama , et al. August 9, 2 | 2011-08-09 |
| Reliability Enhancement Of Metal Thermal Interface App 20110180923 - HUMENIK; JAMES N. ; et al. | 2011-07-28 |
| Segmentation of a die stack for 3D packaging thermal management Grant 7,928,562 - Arvelo , et al. April 19, 2 | 2011-04-19 |
| Semiconductor device assembly having a stress-relieving buffer layer Grant 7,875,972 - Jadhav , et al. January 25, 2 | 2011-01-25 |
| Semiconductor Device Assembly Having A Stress-relieving Buffer Layer App 20100327430 - Jadhav; Virendra R. ; et al. | 2010-12-30 |
| Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging Grant 7,812,438 - Jadhav , et al. October 12, 2 | 2010-10-12 |
| Apparatus and methods for cooling semiconductor integrated circuit package structures Grant 7,768,121 - Colgan , et al. August 3, 2 | 2010-08-03 |
| Lid edge capping load Grant 7,733,655 - Beaumier , et al. June 8, 2 | 2010-06-08 |
| Segmentation Of A Die Stack For 3d Packaging Thermal Management App 20100019377 - Arvelo; Amilcar R. ; et al. | 2010-01-28 |
| Lid Edge Capping Load App 20100020503 - BEAUMIER; MARTIN ; et al. | 2010-01-28 |
| Via Offsetting To Reduce Stress Under The First Level Interconnect (fli) In Microelectronics Packaging App 20090174084 - Jadhav; Virendra R. ; et al. | 2009-07-09 |
| Microjet Module Assembly App 20090095444 - Bezama; Raschid J. ; et al. | 2009-04-16 |
| Chip Package Assembly Using Chip Heat To Cure And Verify App 20090098666 - Hering; Ronald L. ; et al. | 2009-04-16 |
| Microjet module assembly Grant 7,516,776 - Bezama , et al. April 14, 2 | 2009-04-14 |
| Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages Grant 7,489,512 - Coffin , et al. February 10, 2 | 2009-02-10 |
| Optimized Thermally Conductive Plate and Attachment Method for Enhanced Thermal Performance and Reliability of Flip Chip Organic Packages App 20080303021 - Coffin; Jeffrey T. ; et al. | 2008-12-11 |
| Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures App 20080042264 - Colgan; Evan George ; et al. | 2008-02-21 |
| Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages Grant 7,319,591 - Coffin , et al. January 15, 2 | 2008-01-15 |
| Apparatus and methods for cooling semiconductor integrated circuit package structures Grant 7,288,839 - Colgan , et al. October 30, 2 | 2007-10-30 |
| Optimized Thermally Conductive Plate And Attachment Method For Enhanced Thermal Performance And Reliability Of Flip Chip Organic Packages App 20070236890 - Coffin; Jeffrey T. ; et al. | 2007-10-11 |
| Chip package having chip extension and method Grant 7,250,576 - Colgan , et al. July 31, 2 | 2007-07-31 |
| Optimized Thermally Conductive Plate And Attachment Method For Enhanced Thermal Performance And Reliability Of Flip Chip Organic Packages App 20060268521 - Coffin; Jeffrey T. ; et al. | 2006-11-30 |
| Microjet Module Assembly App 20060260784 - Bezama; Raschid J. ; et al. | 2006-11-23 |
| Chip Package Having Chip Extension And Method App 20060261467 - Colgan; Evan G. ; et al. | 2006-11-23 |
| Apparatus and methods for cooling semiconductor integrated circuit package structures App 20050189568 - Colgan, Evan George ; et al. | 2005-09-01 |
| Thermally efficient semiconductor chip Grant 6,292,367 - Sikka , et al. September 18, 2 | 2001-09-18 |
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