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Patent applications and USPTO patent grants for SIGURD MICROELECTRONICS CORP..The latest application filed is for "sensor package structure and method".
Patent | Date |
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Wafer-level package with metal shielding structure and the manufacturing method thereof Grant 9,831,197 - Yeh , et al. November 28, 2 | 2017-11-28 |
Sensor Package Structure And Method App 20160207762 - LU; CHIH-WEI ;   et al. | 2016-07-21 |
Rf Parameter Calibration Method App 20160146920 - LIN; CHIEN-HUNG ;   et al. | 2016-05-26 |
Optical Package Module App 20140042305 - LIU; CHIU-WEI | 2014-02-13 |
Compact Sensor Package Structure App 20120025211 - YEH; TSAN-LIEN ;   et al. | 2012-02-02 |
Packaging method of a light-sensing semiconductor device and packaging structure thereof Grant 7,547,571 - Chen , et al. June 16, 2 | 2009-06-16 |
Optical sensor chip package Grant 7,405,456 - Chen , et al. July 29, 2 | 2008-07-29 |
Packaging structure of a light-sensing element and fabrication method thereof Grant 7,358,482 - Chen April 15, 2 | 2008-04-15 |
Packaging structure of a light-sensing device with a spacer wall Grant 7,323,675 - Chen January 29, 2 | 2008-01-29 |
Image sensor package structure and image sensing module Grant 7,297,918 - Chen , et al. November 20, 2 | 2007-11-20 |
Image sensing chip package structure Grant 7,282,788 - Chen October 16, 2 | 2007-10-16 |
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