loadpatents
name:-0.005767822265625
name:-0.011215925216675
name:-0.00043988227844238
SIGURD MICROELECTRONICS CORP. Patent Filings

SIGURD MICROELECTRONICS CORP.

Patent Applications and Registrations

Patent applications and USPTO patent grants for SIGURD MICROELECTRONICS CORP..The latest application filed is for "sensor package structure and method".

Company Profile
0.8.5
  • SIGURD MICROELECTRONICS CORP. - Shih-Chu N/A TW
  • SIGURD MICROELECTRONICS CORP. - SHIN-CHU TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wafer-level package with metal shielding structure and the manufacturing method thereof
Grant 9,831,197 - Yeh , et al. November 28, 2
2017-11-28
Sensor Package Structure And Method
App 20160207762 - LU; CHIH-WEI ;   et al.
2016-07-21
Rf Parameter Calibration Method
App 20160146920 - LIN; CHIEN-HUNG ;   et al.
2016-05-26
Optical Package Module
App 20140042305 - LIU; CHIU-WEI
2014-02-13
Compact Sensor Package Structure
App 20120025211 - YEH; TSAN-LIEN ;   et al.
2012-02-02
Packaging method of a light-sensing semiconductor device and packaging structure thereof
Grant 7,547,571 - Chen , et al. June 16, 2
2009-06-16
Optical sensor chip package
Grant 7,405,456 - Chen , et al. July 29, 2
2008-07-29
Packaging structure of a light-sensing element and fabrication method thereof
Grant 7,358,482 - Chen April 15, 2
2008-04-15
Packaging structure of a light-sensing device with a spacer wall
Grant 7,323,675 - Chen January 29, 2
2008-01-29
Image sensor package structure and image sensing module
Grant 7,297,918 - Chen , et al. November 20, 2
2007-11-20
Image sensing chip package structure
Grant 7,282,788 - Chen October 16, 2
2007-10-16

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