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Patent applications and USPTO patent grants for Siew; Yongkong.The latest application filed is for "methods of fabricating a semiconductor device having a via structure and an interconnection structure".
Patent | Date |
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Methods of fabricating a semiconductor device having a via structure and an interconnection structure Grant 10,062,606 - Siew , et al. August 28, 2 | 2018-08-28 |
Methods Of Fabricating A Semiconductor Device Having A Via Structure And An Interconnection Structure App 20180102285 - SIEW; Yongkong ;   et al. | 2018-04-12 |
Methods of fabricating a semiconductor device having a via structure and an interconnection structure Grant 9,905,458 - Siew , et al. February 27, 2 | 2018-02-27 |
Semiconductor device and method of fabricating the same Grant 9,768,025 - Siew , et al. September 19, 2 | 2017-09-19 |
Semiconductor Device And Method Of Fabricating The Same App 20170125248 - SIEW; YONGKONG ;   et al. | 2017-05-04 |
Methods Of Fabricating A Semiconductor Device Having A Via Structure And An Interconnection Structure App 20160163586 - SIEW; Yongkong ;   et al. | 2016-06-09 |
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