Siegel; Harry Michael

Patent Applications and Registrations

Patent applications and USPTO patent grants for Siegel; Harry Michael.The latest application filed is for "method for providing a redistribution metal layer in an integrated circuit".

Company Profile

0.14.13

Siegel; Harry Michael - Hurst TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for providing a redistribution metal layer in an integrated circuit Grant 8,163,645 - Thomas , et al. April 24, 2	2012-04-24
Method for providing a redistribution metal layer in an integrated circuit App 20100297841 - Thomas; Danielle A. ; et al.	2010-11-25
System for providing a redistribution metal layer in an integrated circuit Grant 7,786,582 - Thomas , et al. August 31, 2	2010-08-31
Method for using a pre-formed film in a transfer molding process for an integrated circuit Grant 7,595,017 - Siegel , et al. September 29, 2	2009-09-29
System and method for controlling integrated circuit die height and planarity Grant 7,456,050 - Siegel , et al. November 25, 2	2008-11-25
Embedded flat film molding Grant 7,202,110 - Chiu , et al. April 10, 2	2007-04-10
System for providing a redistribution metal layer in an integrated circuit App 20060234423 - Thomas; Danielle A. ; et al.	2006-10-19
Integrated circuit package with exposed die surfaces and auxiliary attachment Grant 7,109,574 - Chiu , et al. September 19, 2	2006-09-19
Method for providing a redistribution metal layer in an integrated circuit Grant 7,096,581 - Thomas , et al. August 29, 2	2006-08-29
Integrated lid formed on MEMS device Grant 7,098,065 - Chiu , et al. August 29, 2	2006-08-29
Integrated Lid Formed On Mems Device App 20060065961 - Chiu; Anthony M. ; et al.	2006-03-30
System and method for aligning an integrated circuit die on an integrated circuit substrate Grant 6,951,125 - Siegel , et al. October 4, 2	2005-10-04
Embedded flat film molding App 20050161784 - Chiu, Anthony M. ; et al.	2005-07-28
Embedded flat film molding Grant 6,900,508 - Chiu , et al. May 31, 2	2005-05-31
System and method for controlling integrated circuit die height and planarity App 20050001330 - Siegel, Harry Michael ; et al.	2005-01-06
Method and system for removing heat from an active area of an integrated circuit device Grant 6,785,137 - Siegel August 31, 2	2004-08-31
System and method for direct convective cooling of an exposed integrated circuit die surface Grant 6,771,500 - Siegel , et al. August 3, 2	2004-08-03
Method And System For Removing Heat From An Active Area Of An Integrated Circuit Device App 20040017661 - Siegel, Harry Michael	2004-01-29
Integrated circuit package with exposed die surfaces and auxiliary attachment App 20040017000 - Chiu, Anthony M. ; et al.	2004-01-29
Embedded flat film molding App 20030193072 - Chiu, Anthony M. ; et al.	2003-10-16
System and method for providing a redistribution metal layer in an integrated circuit App 20030167632 - Thomas, Danielle A. ; et al.	2003-09-11
Scratch resistance improvement by filling metal gaps Grant 6,603,192 - Thomas , et al. August 5, 2	2003-08-05
System And Method For Providing Mechanical Planarization Of A Sequential Build Up Substrate For An Integrated Circuit Package App 20030141595 - Chiu, Anthony M. ; et al.	2003-07-31
System and method for using a pre-formed film in a transfer molding process for an integrated circuit App 20030143406 - Siegel, Harry Michael ; et al.	2003-07-31
System and method for aligning an integrated circuit die on an integrated circuit substrate App 20030140678 - Siegel, Harry Michael ; et al.	2003-07-31
System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package Grant 6,600,227 - Chiu , et al. July 29, 2	2003-07-29
Scratch Resistance Improvement By Filling Metal Gaps App 20030071287 - THOMAS, DANIELLE A. ; et al.	2003-04-17

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.