Patent | Date |
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Method for providing a redistribution metal layer in an integrated circuit Grant 8,163,645 - Thomas , et al. April 24, 2 | 2012-04-24 |
Method for providing a redistribution metal layer in an integrated circuit App 20100297841 - Thomas; Danielle A. ;   et al. | 2010-11-25 |
System for providing a redistribution metal layer in an integrated circuit Grant 7,786,582 - Thomas , et al. August 31, 2 | 2010-08-31 |
Method for using a pre-formed film in a transfer molding process for an integrated circuit Grant 7,595,017 - Siegel , et al. September 29, 2 | 2009-09-29 |
System and method for controlling integrated circuit die height and planarity Grant 7,456,050 - Siegel , et al. November 25, 2 | 2008-11-25 |
Embedded flat film molding Grant 7,202,110 - Chiu , et al. April 10, 2 | 2007-04-10 |
System for providing a redistribution metal layer in an integrated circuit App 20060234423 - Thomas; Danielle A. ;   et al. | 2006-10-19 |
Integrated circuit package with exposed die surfaces and auxiliary attachment Grant 7,109,574 - Chiu , et al. September 19, 2 | 2006-09-19 |
Method for providing a redistribution metal layer in an integrated circuit Grant 7,096,581 - Thomas , et al. August 29, 2 | 2006-08-29 |
Integrated lid formed on MEMS device Grant 7,098,065 - Chiu , et al. August 29, 2 | 2006-08-29 |
Integrated Lid Formed On Mems Device App 20060065961 - Chiu; Anthony M. ;   et al. | 2006-03-30 |
System and method for aligning an integrated circuit die on an integrated circuit substrate Grant 6,951,125 - Siegel , et al. October 4, 2 | 2005-10-04 |
Embedded flat film molding App 20050161784 - Chiu, Anthony M. ;   et al. | 2005-07-28 |
Embedded flat film molding Grant 6,900,508 - Chiu , et al. May 31, 2 | 2005-05-31 |
System and method for controlling integrated circuit die height and planarity App 20050001330 - Siegel, Harry Michael ;   et al. | 2005-01-06 |
Method and system for removing heat from an active area of an integrated circuit device Grant 6,785,137 - Siegel August 31, 2 | 2004-08-31 |
System and method for direct convective cooling of an exposed integrated circuit die surface Grant 6,771,500 - Siegel , et al. August 3, 2 | 2004-08-03 |
Method And System For Removing Heat From An Active Area Of An Integrated Circuit Device App 20040017661 - Siegel, Harry Michael | 2004-01-29 |
Integrated circuit package with exposed die surfaces and auxiliary attachment App 20040017000 - Chiu, Anthony M. ;   et al. | 2004-01-29 |
Embedded flat film molding App 20030193072 - Chiu, Anthony M. ;   et al. | 2003-10-16 |
System and method for providing a redistribution metal layer in an integrated circuit App 20030167632 - Thomas, Danielle A. ;   et al. | 2003-09-11 |
Scratch resistance improvement by filling metal gaps Grant 6,603,192 - Thomas , et al. August 5, 2 | 2003-08-05 |
System And Method For Providing Mechanical Planarization Of A Sequential Build Up Substrate For An Integrated Circuit Package App 20030141595 - Chiu, Anthony M. ;   et al. | 2003-07-31 |
System and method for using a pre-formed film in a transfer molding process for an integrated circuit App 20030143406 - Siegel, Harry Michael ;   et al. | 2003-07-31 |
System and method for aligning an integrated circuit die on an integrated circuit substrate App 20030140678 - Siegel, Harry Michael ;   et al. | 2003-07-31 |
System and method for providing mechanical planarization of a sequential build up substrate for an integrated circuit package Grant 6,600,227 - Chiu , et al. July 29, 2 | 2003-07-29 |
Scratch Resistance Improvement By Filling Metal Gaps App 20030071287 - THOMAS, DANIELLE A. ;   et al. | 2003-04-17 |