SIDONE; Girard
Patent Applications and Registrations
Patent applications and USPTO patent grants for SIDONE; Girard.The latest application filed is for "solder material and method for die attachment".
- SIDONE; Girard - Bordentown NJ
- Sidone; Girard - Hamilton Township NJ
| Patent | Date |
|---|---|
| Solder Material And Method For Die Attachment App 20200203304 - GULINO; Angelo ; et al. | 2020-06-25 |
| Solder Preforms and Solder Alloy Assembly Methods App 20180020554 - Koep; Paul Joseph ; et al. | 2018-01-18 |
| Solder preforms and solder alloy assembly methods Grant 9,801,285 - Koep , et al. October 24, 2 | 2017-10-24 |
| Solder Preforms And Solder Alloy Assembly Methods App 20150078810 - Koep; Paul Joseph ; et al. | 2015-03-19 |
| Latch for electronic card faceplates Grant D498,467 - Brogle , et al. November 16, 2 | 2004-11-16 |
| Anti-rotation ground clip for faceplates Grant 6,267,607 - Fitch , et al. July 31, 2 | 2001-07-31 |
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