Sidhu; Rajen S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sidhu; Rajen S..The latest application filed is for "hybrid low metal loading flux".

Company Profile

3.21.31

Sidhu; Rajen S. - Portland OR
Sidhu; Rajen S. - Chandler AZ
- Chandler AZ US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Foam composite Grant 10,651,108 - Tang , et al.	2020-05-12
Hybrid Low Metal Loading Flux App 20180236609 - SIDHU; Rajen S. ; et al.	2018-08-23
Package structure to enhance yield of TMI interconnections Grant 10,049,971 - De Bonis , et al. August 14, 2	2018-08-14
Hybrid low metal loading flux Grant 9,950,393 - Sidhu , et al. April 24, 2	2018-04-24
Foam Composite App 20180005917 - Tang; Zhizhong ; et al.	2018-01-04
Package Structure To Enhance Yield of TMI Interconnections App 20170207152 - De Bonis; Thomas J. ; et al.	2017-07-20
Package structure to enhance yield of TMI interconnections Grant 9,613,933 - De Bonis , et al. April 4, 2	2017-04-04
Methods of forming ultra thin package structures including low temperature solder and structures formed therby Grant 9,461,014 - Srinivasan , et al. October 4, 2	2016-10-04
Hybrid Interconnect For Low Temperature Attach App 20160260679 - Mirpuri; Kabirkumar J. ; et al.	2016-09-08
Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby Grant 9,394,619 - Sidhu , et al. July 19, 2	2016-07-19
Flux materials for heated solder placement and associated techniques and configurations Grant 9,283,641 - Sidhu , et al. March 15, 2	2016-03-15
Multi-solder techniques and configurations for integrated circuit package assembly Grant 9,257,405 - Sidhu , et al. February 9, 2	2016-02-09
Package Structure To Enhance Yield of TMI Interconnections App 20150255415 - De Bonis; Thomas J. ; et al.	2015-09-10
Methods Of Forming Ultra Thin Package Structures Including Low Temperature Solder And Structures Formed Therby App 20150221609 - Srinivasan; Sriram ; et al.	2015-08-06
Methods of forming ultra thin package structures including low temperature solder and structures formed therby Grant 9,064,971 - Srinivasan , et al. June 23, 2	2015-06-23
Functional material systems and processes for package-level interconnects Grant 9,024,453 - Sidhu , et al. May 5, 2	2015-05-05
Hybrid solder and filled paste in microelectronic packaging Grant 8,920,934 - Jiang , et al. December 30, 2	2014-12-30
Hybrid solder and filled paste in microelectronic packaging Grant 08920934 -	2014-12-30
Techniques and configurations for surface treatment of an integrated circuit substrate Grant 8,895,365 - Ramalingam , et al. November 25, 2	2014-11-25
Paste thermal interface materials Grant 8,896,110 - Hu , et al. November 25, 2	2014-11-25
Multi-solder Techniques And Configurations For Integrated Circuit Package Assembly App 20140319682 - Sidhu; Rajen S. ; et al.	2014-10-30
Hybrid Solder And Filled Paste In Microelectronic Packaging App 20140291843 - Jiang; Hongjin ; et al.	2014-10-02
Paste Thermal Interface Materials App 20140264820 - Hu; Wei ; et al.	2014-09-18
Methods Of Adding Dopants To Conductive Interconnect Structures In Substrate Technologies And Structures Formed Thereby App 20140268534 - Sidhu; Rajen S. ; et al.	2014-09-18
Multi-solder techniques and configurations for integrated circuit package assembly Grant 8,809,181 - Sidhu , et al. August 19, 2	2014-08-19
Functional Material Systems And Processes For Package-level Interconnects App 20140225265 - Sidhu; Rajen S. ; et al.	2014-08-14
Solder Paste Material Technology For Elimination Of High Warpage Surface Mount Assembly Defects App 20140175160 - Sidhu; Rajen S. ; et al.	2014-06-26
Methods Of Forming Ultra Thin Package Structures Including Low Temperature Solder And Structures Formed Therby App 20140175644 - Srinivasan; Sriram ; et al.	2014-06-26
Multi-solder Techniques And Configurations For Integrated Circuit Package Assembly App 20140124925 - Sidhu; Rajen S. ; et al.	2014-05-08
Substrate metallization and ball attach metallurgy with a novel dopant element Grant 8,701,281 - Sidhu , et al. April 22, 2	2014-04-22
Flux Materials For Heated Solder Placement And Associated Techniques And Configurations App 20140084461 - Sidhu; Rajen S. ; et al.	2014-03-27
Techniques And Configurations For Surface Treatment Of An Integrated Circuit Substrate App 20140061902 - Ramalingam; Suriyakala ; et al.	2014-03-06
Hybrid Low Metal Loading Flux App 20130341379 - Sidhu; Rajen S. ; et al.	2013-12-26
Substrate Metallization And Ball Attach Metallurgy With A Novel Dopant Element App 20110147066 - Sidhu; Rajen S. ; et al.	2011-06-23

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