loadpatents
name:-0.0027110576629639
name:-0.012423038482666
name:-0.0005190372467041
Sichmann; Eggo Patent Filings

Sichmann; Eggo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sichmann; Eggo.The latest application filed is for "process and device for soldering in the vapor phase".

Company Profile
0.11.2
  • Sichmann; Eggo - Gelnhausen DE
  • Sichmann; Eggo - Geinhausen DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Process And Device For Soldering In The Vapor Phase
App 20110195199 - Huber; Marco ;   et al.
2011-08-11
Method and device for controlling thickness during spin coating
Grant 6,814,825 - Becker , et al. November 9, 2
2004-11-09
Apparatus and method for avoiding gas bubbles when transporting a liquid by means of pumps
App 20020046653 - Sichmann, Eggo ;   et al.
2002-04-25
Magnetron sputtering cathode with magnet disposed between two yoke plates
Grant 6,344,114 - Sichmann , et al. February 5, 2
2002-02-05
Device for gripping, holdings and/or transporting substrates
Grant 6,054,029 - Kempf , et al. April 25, 2
2000-04-25
Device for cathode sputtering
Grant 5,863,399 - Sichmann January 26, 1
1999-01-26
Apparatus for the transfer of substrates
Grant 5,612,068 - Kempf , et al. March 18, 1
1997-03-18
Apparatus for cathode sputtering
Grant 5,330,632 - Sichmann July 19, 1
1994-07-19
Sputtering cathode
Grant 5,266,178 - Sichmann November 30, 1
1993-11-30
Linear thermal evaporator for vacuum vapor depositing apparatus
Grant 5,216,742 - Krug , et al. June 1, 1
1993-06-01
Sputtering cathode for coating substrates in cathode sputtering apparatus
Grant 5,133,850 - Kukla , et al. July 28, 1
1992-07-28
Method for coating polymethylmethacrylate substrate with aluminum
Grant 5,074,984 - Sichmann , et al. December 24, 1
1991-12-24
Process for coating a substrate with electrically conductive materials
Grant 5,006,213 - Sichmann , et al. April 9, 1
1991-04-09

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