loadpatents
Patent applications and USPTO patent grants for Sichmann; Eggo.The latest application filed is for "process and device for soldering in the vapor phase".
Patent | Date |
---|---|
Process And Device For Soldering In The Vapor Phase App 20110195199 - Huber; Marco ;   et al. | 2011-08-11 |
Method and device for controlling thickness during spin coating Grant 6,814,825 - Becker , et al. November 9, 2 | 2004-11-09 |
Apparatus and method for avoiding gas bubbles when transporting a liquid by means of pumps App 20020046653 - Sichmann, Eggo ;   et al. | 2002-04-25 |
Magnetron sputtering cathode with magnet disposed between two yoke plates Grant 6,344,114 - Sichmann , et al. February 5, 2 | 2002-02-05 |
Device for gripping, holdings and/or transporting substrates Grant 6,054,029 - Kempf , et al. April 25, 2 | 2000-04-25 |
Device for cathode sputtering Grant 5,863,399 - Sichmann January 26, 1 | 1999-01-26 |
Apparatus for the transfer of substrates Grant 5,612,068 - Kempf , et al. March 18, 1 | 1997-03-18 |
Apparatus for cathode sputtering Grant 5,330,632 - Sichmann July 19, 1 | 1994-07-19 |
Sputtering cathode Grant 5,266,178 - Sichmann November 30, 1 | 1993-11-30 |
Linear thermal evaporator for vacuum vapor depositing apparatus Grant 5,216,742 - Krug , et al. June 1, 1 | 1993-06-01 |
Sputtering cathode for coating substrates in cathode sputtering apparatus Grant 5,133,850 - Kukla , et al. July 28, 1 | 1992-07-28 |
Method for coating polymethylmethacrylate substrate with aluminum Grant 5,074,984 - Sichmann , et al. December 24, 1 | 1991-12-24 |
Process for coating a substrate with electrically conductive materials Grant 5,006,213 - Sichmann , et al. April 9, 1 | 1991-04-09 |
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