Shyu; Jin-Cherng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shyu; Jin-Cherng.The latest application filed is for "method for fabricating wick microstructures in heat pipes".

Company Profile

0.5.6

Shyu; Jin-Cherng - Pingtung County TW
Shyu; Jin-Cherng - Hsinchu TW
Shyu; Jin-Cherng - Neipu Shiang TW
Shyu; Jin-Cherng - Pingtung TW
Shyu; Jin-Cherng - Ping Tung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Fabricating Wick Microstructures In Heat Pipes App 20100229394 - Tsai; Ming-Jye ; et al.	2010-09-16
Method of fabricating heat dissipating apparatus Grant 7,730,605 - Yeh , et al. June 8, 2	2010-06-08
Heat dissipating apparatus having micro-structure layer and method of fabricating the same Grant 7,578,338 - Yeh , et al. August 25, 2	2009-08-25
Heat dissipating apparatus having micro-structure layer and method of fabricating the same App 20070193029 - Yeh; Lan-Kai ; et al.	2007-08-23
Heat dissipating apparatus having micro-structure layer and method of fabricating the same App 20070187074 - Yeh; Lan-Kai ; et al.	2007-08-16
Heat dissipating apparatus having micro-structure layer and method of fabricating the same Grant 7,237,337 - Yeh , et al. July 3, 2	2007-07-03
Method for fabricating wick microstructures in heat pipes App 20060143916 - Tsai; Ming-Jye ; et al.	2006-07-06
Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device Grant 7,011,145 - Yeh , et al. March 14, 2	2006-03-14
Heat dissipating appatatus having micro-structure layer and method of fabricating the same App 20060005952 - Yeh; Lan-Kai ; et al.	2006-01-12
Method For Enhancing Mobility Of Working Fluid In Liquid/gas Phase Heat Dissipating Device App 20060005951 - Yeh; Lan-Kai ; et al.	2006-01-12
Heat-dissipation device Grant 6,932,150 - Yeh , et al. August 23, 2	2005-08-23

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