Shykind; David N.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shykind; David N..The latest application filed is for "method of creating a maskless air gap in back end interconnections with double self-aligned vias".
- Shykind; David N. - Buxton OR
- Shykind; David N. - Sherwood OR
| Patent | Date |
|---|---|
| Method of manufacturing a circuit board Grant 9,596,766 - Shykind , et al. March 14, 2 | 2017-03-14 |
| Method of creating a maskless air gap in back end interconnections with double self-aligned vias Grant 9,324,652 - Chandhok , et al. April 26, 2 | 2016-04-26 |
| Method Of Creating A Maskless Air Gap In Back End Interconnections With Double Self-aligned Vias App 20150171012 - CHANDHOK; Manish ; et al. | 2015-06-18 |
| Method of creating a maskless air gap in back end interconnects with double self-aligned vias Grant 8,975,138 - Chandhok , et al. March 10, 2 | 2015-03-10 |
| Method Of Creating A Maskless Air Gap In Back End Interconnects With Double Self-aligned Vias App 20150001724 - CHANDHOK; Manish ; et al. | 2015-01-01 |
| Impedance compensation for circuit board breakout region Grant 6,700,457 - McCall , et al. March 2, 2 | 2004-03-02 |
| Impedance compensation for curcuit board breakout region App 20030116831 - McCall, James A. ; et al. | 2003-06-26 |
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