Shum; Pak-Chum Danny
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shum; Pak-Chum Danny.The latest application filed is for "3d mram with through silicon vias or through silicon trenches magnetic shielding".
- Shum; Pak-Chum Danny - Singapore SG
| Patent | Date |
|---|---|
| MRAM magnetic shielding with fan-out wafer level packaging Grant 10,475,985 - Bhushan , et al. Nov | 2019-11-12 |
| Magnetic shielding for MTJ device or bit Grant 10,096,768 - Jiang , et al. October 9, 2 | 2018-10-09 |
| 3D MRAM with through silicon vias or through silicon trenches magnetic shielding Grant 9,786,839 - Bhushan , et al. October 10, 2 | 2017-10-10 |
| 3d Mram With Through Silicon Vias Or Through Silicon Trenches Magnetic Shielding App 20170025601 - BHUSHAN; Bharat ; et al. | 2017-01-26 |
| Mram Magnetic Shielding With Fan-out Wafer Level Packaging App 20160359100 - BHUSHAN; Bharat ; et al. | 2016-12-08 |
| Magnetic Shielding For Mtj Device Or Bit App 20160351792 - JIANG; Yi ; et al. | 2016-12-01 |
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