SHUE; Hong-Seng

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHUE; Hong-Seng.The latest application filed is for "organic interposer including a dual-layer inductor structure and methods of forming the same".

Company Profile

7.20.26

SHUE; Hong-Seng - Zhubei City TW
SHUE; Hong-Seng - Hsinchu County TW
Shue; Hong-Seng - Zhubei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Organic Interposer Including A Dual-layer Inductor Structure And Methods Of Forming The Same App 20220285295 - CHIANG; Wei-Han ; et al.	2022-09-08
Bump Integration with Redistribution Layer App 20220246565 - Yang; Ting-Li ; et al.	2022-08-04
Chip Structure With Conductive Via Structure And Method For Forming The Same App 20220216143 - YANG; Ting-Li ; et al.	2022-07-07
Shielding structures Grant 11,380,639 - Huang , et al. July 5, 2	2022-07-05
Organic interposer including a dual-layer inductor structure and methods of forming the same Grant 11,348,884 - Chiang , et al. May 31, 2	2022-05-31
Semiconductor packages with crack preventing structure Grant 11,342,291 - Chuang , et al. May 24, 2	2022-05-24
Organic Interposer Including A Dual-layer Inductor Structure And Methods Of Forming The Same App 20220157744 - CHIANG; Wei-Han ; et al.	2022-05-19
Method For Detecting Defects In Semiconductor Device App 20210366794 - CHEN; YANG-CHE ; et al.	2021-11-25
Semiconductor Device and Method of Forming Same App 20210351139 - Tseng; Chih-Hsiang ; et al.	2021-11-11
Semiconductor device having probe pads and seal ring Grant 11,088,037 - Chen , et al. August 10, 2	2021-08-10
Semiconductor device and method of forming same Grant 11,075,173 - Tseng , et al. July 27, 2	2021-07-27
Method for forming fuse pad and bond pad of integrated circuit Grant 11,011,462 - Yang , et al. May 18, 2	2021-05-18
Shielding Structures App 20210091029 - Huang; Chih-Fan ; et al.	2021-03-25
Shielding structures Grant 10,861,810 - Huang , et al. December 8, 2	2020-12-08
Semiconductor Packages With Crack Preventing Structure App 20200357760 - CHUANG; Yao-Chun ; et al.	2020-11-12
Shielding Structures App 20200168574 - Huang; Chih-Fan ; et al.	2020-05-28
Semiconductor Device And Method Of Forming Same App 20200135664 - Tseng; Chih-Hsiang ; et al.	2020-04-30
Semiconductor Device And Manufacturing Method Of The Same App 20200075435 - CHEN; YANG-CHE ; et al.	2020-03-05
Chip Structure And Method For Forming The Same App 20200058589 - SHUE; Hong-Seng ; et al.	2020-02-20
Semiconductor isolation structure with air gaps in deep trenches Grant 10,049,941 - Shue , et al. August 14, 2	2018-08-14
Methods for forming a high-voltage super junction by trench and epitaxial doping Grant 9,614,031 - Yang , et al. April 4, 2	2017-04-04
Method For Forming Fuse Pad And Bond Pad Of Integrated Circuit App 20170062334 - Yang; Tai-I ; et al.	2017-03-02
Semiconductor structure and manufacturing method thereof Grant 9,558,986 - Yang , et al. January 31, 2	2017-01-31
Method for forming fuse pad and bond pad of integrated circuit Grant 9,496,221 - Yang , et al. November 15, 2	2016-11-15
Semiconductor Isolation Structure with Air Gaps in Deep Trenches App 20160172250 - Shue; Hong-Seng ; et al.	2016-06-16
Semiconductor isolation structure with air gaps in deep trenches Grant 9,269,609 - Shue , et al. February 23, 2	2016-02-23
High-voltage Super Junction By Trench And Epitaxial Doping App 20150325642 - Yang; Tai-I ; et al.	2015-11-12
Methods And Apparatus For MEMS Structure Release App 20150308743 - Yang; Tai-I ; et al.	2015-10-29
Methods and apparatus for MEMS structure release Grant 9,096,428 - Yang , et al. August 4, 2	2015-08-04
High-voltage super junction by trench and epitaxial doping Grant 9,093,520 - Yang , et al. July 28, 2	2015-07-28
Semiconductor Structure And Manufacturing Method Thereof App 20150076660 - YANG; TAI-I ; et al.	2015-03-19
Super junction trench metal oxide semiconductor device and method of making the same Grant 8,975,153 - Yang , et al. March 10, 2	2015-03-10
High-voltage Super Junction By Trench And Epitaxial Doping App 20150061007 - Yang; Tai-I ; et al.	2015-03-05
Optical inspection system and optical inspection method Grant 8,953,155 - Yang , et al. February 10, 2	2015-02-10
Super Junction Trench Metal Oxide Semiconductor Device And Method Of Making The Same App 20140264559 - Yang; Tai-I ; et al.	2014-09-18
Methods And Apparatus For MEMS Structure Release App 20140252512 - Yang; Tai-I ; et al.	2014-09-11
Masking-Less Fuse Formation with Oxide Remaining App 20130341757 - Yang; Tai-I ; et al.	2013-12-26
Semiconductor Isolation Structure with Air Gaps in Deep Trenches App 20130320459 - Shue; Hong-Seng ; et al.	2013-12-05
Deep well process for MEMS pressure sensor Grant 8,558,330 - Yu , et al. October 15, 2	2013-10-15
Deep Well Process For Mems Pressure Sensor App 20130105923 - Yu; Shao-Chi ; et al.	2013-05-02

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