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SHUDAI; Hideki Patent Filings

SHUDAI; Hideki

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHUDAI; Hideki.The latest application filed is for "welding device for plate laminated body and producing method for plate structure".

Company Profile
3.3.5
  • SHUDAI; Hideki - Tokyo JP
  • Shudai; Hideki - Koto-ku JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Welding Device For Plate Laminated Body And Producing Method For Plate Structure
App 20220241905 - YAMADA; Keisuke ;   et al.
2022-08-04
Welding Device For Non-circular Plate And Producing Method For Non-circular Plate Structure
App 20220234127 - YAMADA; Keisuke ;   et al.
2022-07-28
Welding device and welding method
Grant 11,167,368 - Kitagawa , et al. November 9, 2
2021-11-09
Welding device
Grant 10,792,748 - Kitagawa , et al. October 6, 2
2020-10-06
Welding Device
App 20190232410 - KITAGAWA; Hisashi ;   et al.
2019-08-01
Welding Device And Welding Method
App 20190151977 - KITAGAWA; Hisashi ;   et al.
2019-05-23
Method and system for making ice by underwater supercooling release and low temperature water supply system comprising it
Grant 6,915,643 - Fukumoto , et al. July 12, 2
2005-07-12
Method and system for making ice by underwater supercooling release and low temperature water supply system comprising it
App 20040231343 - Fukumoto, Hiromichi ;   et al.
2004-11-25

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