loadpatents
name:-0.0038468837738037
name:-0.002065896987915
name:-0.0011739730834961
Shouda; Atsushi Patent Filings

Shouda; Atsushi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shouda; Atsushi.The latest application filed is for "multilayered printed circuit board and manufacturing method thereof".

Company Profile
0.5.6
  • Shouda; Atsushi - Ogaki-shi JP
  • Shouda; Atsushi - Ogaki JP
  • Shouda; Atsushi - Ogakishi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multilayered Printed Circuit Board And Manufacturing Method Thereof
App 20120125680 - Hirose; Naohiro ;   et al.
2012-05-24
Multilayered printed circuit board and manufacturing method thereof
Grant 8,148,643 - Hirose , et al. April 3, 2
2012-04-03
Method of manufacturing a multilayered printed circuit board
Grant 7,832,098 - Hirose , et al. November 16, 2
2010-11-16
Method of manufacturing multilayered circuit board
Grant 7,415,761 - Hirose , et al. August 26, 2
2008-08-26
Multilayered Printed Circuit Board And Manufacturing Method Thereof
App 20080189943 - HIROSE; Naohiro ;   et al.
2008-08-14
Multilayered Printed Circuit Board And Manufacturing Method Thereof
App 20080173473 - HIROSE; Naohiro ;   et al.
2008-07-24
Printed-circuit board and method of manufacture thereof
Grant 6,809,415 - Tsukada , et al. October 26, 2
2004-10-26
Multilayered printed circuit board and manufacturing method therefor
App 20040025333 - Hirose, Naohiro ;   et al.
2004-02-12
Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating
Grant 6,591,495 - Hirose , et al. July 15, 2
2003-07-15
Multilayered printed circuit board and manufacturing method therefor
App 20010042637 - Hirose, Naohiro ;   et al.
2001-11-22
Printed-circuit board and method of manufacture thereof
App 20010002728 - Tsukada, Kiyotaka ;   et al.
2001-06-07

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