Shizuhata; Hironori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shizuhata; Hironori.The latest application filed is for "adhesive composition, adhesive sheet and production process for semiconductor device".

Company Profile

0.7.10

Shizuhata; Hironori - Tokyo JP
Shizuhata; Hironori - Itabashi-ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive composition, adhesive sheet and production process for semiconductor device Grant 9,562,179 - Saiki , et al. February 7, 2	2017-02-07
Adhesive Composition, Adhesive Sheet And Production Process For Semiconductor Device App 20160017188 - Saiki; Naoya ; et al.	2016-01-21
Adhesive composition, adhesive sheet and production process for semiconductor device Grant 9,184,082 - Saiki , et al. November 10, 2	2015-11-10
Adhesive composition and adhesive sheet Grant 8,247,503 - Saiki , et al. August 21, 2	2012-08-21
Adhesive composition, adhesive sheet and production method of semiconductor device Grant 7,851,335 - Ichikawa , et al. December 14, 2	2010-12-14
Adhesive composition, adhesive sheet and production process for semiconductor device Grant 7,842,551 - Saiki , et al. November 30, 2	2010-11-30
Composite Type Semiconductor Device Spacer Sheet, Semiconductor Package Using The Same, Composite Type Semiconductor Device Manufacturing Method, And Composite Type Semiconductor Device App 20100090323 - Shinoda; Tomonori ; et al.	2010-04-15
Adhesive composition and adhesive sheet Grant 7,674,859 - Saiki , et al. March 9, 2	2010-03-09
Composite Semiconductor Device, Semiconductor Package And Spacer Sheet Used In The Same, And Method For Manufacturing Composite Semiconductor Device App 20100025837 - Shinoda; Tomonori ; et al.	2010-02-04
Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device App 20090246915 - Ichikawa; Isao ; et al.	2009-10-01
Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device App 20090246913 - Ichikawa; Isao ; et al.	2009-10-01
Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device App 20090170284 - Saiki; Naoya ; et al.	2009-07-02
Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device App 20090004829 - Saiki; Naoya ; et al.	2009-01-01
Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device App 20080242058 - Ichikawa; Isao ; et al.	2008-10-02
Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device App 20080124839 - Saiki; Naoya ; et al.	2008-05-29
Adhesive composition, adhesive sheet and production process for semiconductor device App 20070276079 - Saiki; Naoya ; et al.	2007-11-29

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