Shiue; Ruey-Yun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shiue; Ruey-Yun.The latest application filed is for "two step molding grinding for packaging applications".

Company Profile

0.10.4

Shiue; Ruey-Yun - Hsin-Chu TW
Shiue; Ruey-Yun - Hsiu-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Two step molding grinding for packaging applications Grant 9,209,048 - Huang , et al. December 8, 2	2015-12-08
Two Step Molding Grinding For Packaging Applications App 20150187607 - Huang; Wen-Chun ; et al.	2015-07-02
Bonding pad structure to minimize IMD cracking Grant 7,759,797 - Liu , et al. July 20, 2	2010-07-20
Top via pattern for bond pad structure Grant 7,323,784 - Yiu , et al. January 29, 2	2008-01-29
Novel bonding pad structure to minimize IMD cracking App 20070035038 - Liu; Chung ; et al.	2007-02-15
Bonding pad structure to minimize IMD cracking Grant 7,135,395 - Liu , et al. November 14, 2	2006-11-14
Top via pattern for bond pad structure App 20060208360 - Yiu; Ho-Yin ; et al.	2006-09-21
Mesh pad structure to eliminate IMD crack on pad Grant 6,875,682 - Liu , et al. April 5, 2	2005-04-05
Novel bonding pad structure to minimize IMD cracking App 20050064693 - Liu, Chung ; et al.	2005-03-24
Dual damascene process flow for a deep sub-micron technology Grant 6,211,069 - Hu , et al. April 3, 2	2001-04-03
Method for making metal capacitors for deep submicrometer processes for semiconductor integrated circuits Grant 6,140,693 - Weng , et al. October 31, 2	2000-10-31
Method for making metal capacitors for deep submicrometer processes for semiconductor integrated circuits Grant 5,946,567 - Weng , et al. August 31, 1	1999-08-31
Bond pad structure for the via plug process Grant 5,923,088 - Shiue , et al. July 13, 1	1999-07-13
Method of forming bond pad structure for the via plug process Grant 5,700,735 - Shiue , et al. December 23, 1	1997-12-23

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