Shirasaka; Kenichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shirasaka; Kenichi.The latest application filed is for "lead frame and package of semiconductor device".

Company Profile

0.22.36

Shirasaka; Kenichi - Hamamatsu JP
Shirasaka; Kenichi - Aira-gun JP
Shirasaka; Kenichi - Hamamatsu-shi JP
Shirasaka; Kenichi - Hamamtsu-shi JP
Shirasaka; Kenichi - Shizuoka-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing method for magnetic sensor and lead frame therefor Grant 8,138,757 - Adachi , et al. March 20, 2	2012-03-20
Lead frame having a die stage smaller than a semiconductor device and a semiconductor device using the same Grant 7,964,942 - Shirasaka , et al. June 21, 2	2011-06-21
Physical quantity sensor, lead frame, and manufacturing method therefor Grant 7,867,827 - Shirasaka , et al. January 11, 2	2011-01-11
Lead frame, sensor including lead frame and method of forming sensor including lead frame Grant 7,829,982 - Shirasaka , et al. November 9, 2	2010-11-09
Physical quantity sensor and lead frame used for same Grant 7,791,180 - Shirasaka September 7, 2	2010-09-07
Method for manufacturing physical quantity sensor Grant 7,754,130 - Shirasaka , et al. July 13, 2	2010-07-13
Physical quantity sensor and manufacturing method therefor Grant 7,727,793 - Shirasaka , et al. June 1, 2	2010-06-01
Semiconductor device Grant 7,607,355 - Shirasaka , et al. October 27, 2	2009-10-27
Lead frame and package of semiconductor device App 20090243058 - Shirasaka; Kenichi	2009-10-01
Physical quantity sensor and manufacturing method therefor Grant 7,595,548 - Shirasaka , et al. September 29, 2	2009-09-29
Microphone package, lead frame, mold substrate, and mounting structure therefor App 20090175479 - Shirasaka; Kenichi	2009-07-09
Semiconductor device and package, and method of manufacturer therefor Grant 7,554,182 - Shirasaka , et al. June 30, 2	2009-06-30
Semiconductor package and semiconductor package mounting method Grant 7,541,294 - Shirasaka June 2, 2	2009-06-02
Lead frame for a magnetic sensor Grant 7,541,665 - Adachi , et al. June 2, 2	2009-06-02
Sensor including lead frame and method of forming sensor including lead frame Grant 7,524,696 - Shirasaka April 28, 2	2009-04-28
Semiconductor device, lead frame, and microphone package therefor App 20090065882 - Shirasaka; Kenichi	2009-03-12
Manufacturing method for magnetic sensor and lead frame therefor Grant 7,494,838 - Adachi , et al. February 24, 2	2009-02-24
Microphone package adapted to semiconductor device and manufacturing method therefor App 20080310663 - Shirasaka; Kenichi ; et al.	2008-12-18
Semiconductor device App 20080229840 - Shirasaka; Kenichi ; et al.	2008-09-25
Semiconductor Device And Packaging Structure Therefor App 20080191325 - SHIRASAKA; KENICHI	2008-08-14
Semiconductor package and lead frame therefor Grant 7,397,112 - Sato , et al. July 8, 2	2008-07-08
Lead Frame Having A Die Stage Smaller Than A Semiconductor Device And A Semiconductor Device Using The Same App 20080073764 - SHIRASAKA; Kenichi ; et al.	2008-03-27
Physical Quantity Sensor, Lead Frame, And Manufacturing Method Therefor App 20080038875 - Shirasaka; Kenichi ; et al.	2008-02-14
Method and apparatus for manufacture and inspection of semiconductor device Grant 7,319,042 - Shirasaka January 15, 2	2008-01-15
Method Of Manufacturing A Semiconductor Package Using A Lead Frame Having Through Holes Or Hollows Therein App 20070292994 - Shirasaka; Kenichi	2007-12-20
Method and apparatus for manufacture and inspection of semiconductor device App 20070264756 - Shirasaka; Kenichi	2007-11-15
Physical quantity sensor, lead frame, and manufacturing method therefor Grant 7,290,448 - Shirasaka , et al. November 6, 2	2007-11-06
Physical Quantity Sensor and Lead Frame Used for Same App 20070220988 - Shirasaka; Kenichi	2007-09-27
Method For Manufacturing Physical Quantity Sensor App 20070184584 - Shirasaka; Kenichi ; et al.	2007-08-09
Method of manufacturing a semiconductor package using lead frame having through holes or hollows therein App 20070126089 - Shirasaka; Kenichi	2007-06-07
Manufacturing method for magnetic sensor and lead frame therefor App 20070099349 - Adachi; Hiroshi ; et al.	2007-05-03
Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein Grant 7,195,953 - Shirasaka March 27, 2	2007-03-27
Manufacturing method for magnetic sensor and lead frame therefor Grant 7,187,063 - Adachi , et al. March 6, 2	2007-03-06
Physical quantity sensor and manufacturing method therefor App 20070028685 - Shirasaka; Kenichi ; et al.	2007-02-08
Semiconductor device and package, and method of manufacture therefor Grant 7,170,149 - Shirasaka , et al. January 30, 2	2007-01-30
Semiconductor device and package, and method of manufacturer therefor App 20070001275 - Shirasaka; Kenichi ; et al.	2007-01-04
Physical quantity sensor, lead frame, and manufacturing method therefor App 20060278027 - Shirasaka; Kenichi ; et al.	2006-12-14
Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein App 20060228833 - Shirasaka; Kenichi	2006-10-12
Manufacturing method for magnetic sensor and lead frame therefor App 20060220193 - Adachi; Hiroshi ; et al.	2006-10-05
Manufacturing method for physical quantity sensor using lead frame and bonding device therefor App 20060211176 - Shirasaka; Kenichi ; et al.	2006-09-21
Sensor including lead frame and method of forming sensor including lead frame App 20060194362 - Shirasaka; Kenichi	2006-08-31
Lead frame, sensor including lead frame, resin composition to be used for resin mold in the sensor, and sensor including the resin mold App 20060185452 - Shirasaka; Kenichi ; et al.	2006-08-24
Lead frame, sensor including lead frame and method of forming sensor including lead frame App 20060186529 - Shirasaka; Kenichi ; et al.	2006-08-24
Semiconductor package and lead frame therefor App 20060138615 - Sato; Takashi ; et al.	2006-06-29
Physical quantity sensor and manufacturing method therefor App 20060087006 - Shirasaka; Kenichi ; et al.	2006-04-27
Lead frame and semiconductor package therefor App 20060071307 - Shirasaka; Kenichi ; et al.	2006-04-06
Semiconductor package and semiconductor package mounting method App 20060060948 - Shirasaka; Kenichi	2006-03-23
Physical quantity sensor, lead frame, and manufacturing method therefor App 20060053909 - Shirasaka; Kenichi ; et al.	2006-03-16
Manufacturing method for magnetic sensor and lead frame therefor App 20060006863 - Adachi; Hiroshi ; et al.	2006-01-12
Semiconductor package and semiconductor package mounting method Grant 6,979,910 - Shirasaka December 27, 2	2005-12-27
Semiconductor package and semiconductor package mounting method Grant 6,861,282 - Shirasaka March 1, 2	2005-03-01
Lead frame and semiconductor device using the same App 20050006733 - Shirasaka, Kenichi ; et al.	2005-01-13
Semiconductor package for improved recognition and mounting App 20040209397 - Shirasaka, Kenichi	2004-10-21
Semiconductor package and lead frame therefor App 20040195661 - Shirasaka, Kenichi	2004-10-07
Semiconductor package and semiconductor package mounting method App 20040173888 - Shirasaka, Kenichi	2004-09-09
Manufacturing method for magnetic sensor and lead frame therefor App 20040103530 - Adachi, Hiroshi ; et al.	2004-06-03
Method and apparatus for manufacture and inspection of semiconductor device App 20030143780 - Shirasaka, Kenichi	2003-07-31
Semiconductor device and package, and method of manufacture therefor App 20020149099 - Shirasaka, Kenichi ; et al.	2002-10-17

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.