loadpatents
name:-0.028808116912842
name:-0.026936054229736
name:-0.00057196617126465
SHIRAI; Yuji Patent Filings

SHIRAI; Yuji

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHIRAI; Yuji.The latest application filed is for "light-emitting component".

Company Profile
0.22.17
  • SHIRAI; Yuji - Kanagawa JP
  • Shirai; Yuji - Tokyo JP
  • Shirai; Yuji - Saku N/A JP
  • Shirai; Yuji - Hamura JP
  • Shirai; Yuji - Kodaira JP
  • Shirai; Yuji - Yatsushiro JP
  • Shirai; Yuji - Fuchu JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Light-emitting Component
App 20210305771 - KONDO; Takashi ;   et al.
2021-09-30
Anesthetic tank, and system for preventing erroneous anesthetic injection
Grant 10,071,219 - Ito , et al. September 11, 2
2018-09-11
Anesthetic Tank, And System For Preventing Erroneous Anesthetic Injection
App 20180243529 - ITO; Masaki ;   et al.
2018-08-30
Shielded electronic components and method of manufacturing the same
Grant 9,001,528 - Yorita , et al. April 7, 2
2015-04-07
Semiconductor device and method of manufacturing the same
Grant 8,763,242 - Kawano , et al. July 1, 2
2014-07-01
Semiconductor device and manufacturing method thereof
Grant 8,742,499 - Nakajima , et al. June 3, 2
2014-06-03
Shielded Electronic Components And Method Of Manufacturing The Same
App 20120292772 - Yorita; Chiko ;   et al.
2012-11-22
Semiconductor Device And Manufacturing Method Thereof
App 20110248389 - YORITA; Chiko ;   et al.
2011-10-13
Semiconductor Device And Method Of Manufacturing The Same
App 20110156225 - Hozoji; Hiroshi ;   et al.
2011-06-30
Semiconductor Device And Method Of Manufacturing The Same
App 20110128713 - KAWANO; Kenya ;   et al.
2011-06-02
Semiconductor Device And Manufacturing Method Thereof
App 20100230789 - Yorita; Chiko ;   et al.
2010-09-16
Shielded Electronic Components And Method Of Manufacturing The Same
App 20100172116 - Yorita; Chiko ;   et al.
2010-07-08
Semiconductor Device And Manufacturing Method Thereof
App 20100109052 - NAKAJIMA; Shizuki ;   et al.
2010-05-06
Semiconductor device
Grant 7,656,030 - Osone , et al. February 2, 2
2010-02-02
Acoustic wave filter and manufacturing method of the same
Grant 7,583,163 - Osone , et al. September 1, 2
2009-09-01
Semiconductor device
Grant 7,554,193 - Osone , et al. June 30, 2
2009-06-30
Acoustic wave filter and manufacturing method of the same
App 20080129412 - Osone; Yasuo ;   et al.
2008-06-05
Semiconductor device
App 20070176298 - Osone; Yasuo ;   et al.
2007-08-02
Semiconductor device
App 20070040255 - Osone; Yasuo ;   et al.
2007-02-22
Semiconductor device and manufacturing method of that
Grant 6,946,327 - Miyamoto , et al. September 20, 2
2005-09-20
Semiconductor integrated circuit device and its manufacturing method
Grant 6,867,123 - Katagiri , et al. March 15, 2
2005-03-15
Wafer level chip size package having rerouting layers
Grant 6,861,742 - Miyamoto , et al. March 1, 2
2005-03-01
Semiconductor device and a method of manufacturing the same
Grant 6,841,881 - Katagiri , et al. January 11, 2
2005-01-11
Semiconductor device and a method of manufacturing the same
Grant 6,828,174 - Katagiri , et al. December 7, 2
2004-12-07
Semiconductor device and manufacturing method of that
App 20040155351 - Miyamoto, Toshio ;   et al.
2004-08-12
Semiconductor integrated circuit device and its manufacturing method
App 20040023450 - Katagiri, Mitsuaki ;   et al.
2004-02-05
Semiconductor device and a method of manufacturing the same
App 20030111737 - Katagiri, Mitsuaki ;   et al.
2003-06-19
Semiconductor device and a method of manufacturing the same
App 20020185744 - Katagiri, Mitsuaki ;   et al.
2002-12-12
Semiconductor device and manufacturing method of that
App 20020093082 - Miyamoto, Toshio ;   et al.
2002-07-18
Semiconductor integrated circuit device
Grant 5,402,318 - Otsuka , et al. March 28, 1
1995-03-28
LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted
Grant 5,358,032 - Arai , et al. October 25, 1
1994-10-25
Semiconductor apparatus of module installing type
Grant 5,315,482 - Tanaka , et al. May 24, 1
1994-05-24
LSI cooling apparatus and computer cooling apparatus
Grant 5,195,576 - Hatada , et al. March 23, 1
1993-03-23
Fuzzy logic semifinished integrated circuit
Grant 4,860,243 - Ueno , et al. August 22, 1
1989-08-22
Fuzzy logic basic circuit and fuzzy logic integrated circuit operable in current mode
Grant 4,694,418 - Ueno , et al. September 15, 1
1987-09-15
Wire bonding apparatus
Grant 4,527,730 - Shirai , et al. July 9, 1
1985-07-09

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