SHIRAI; Seiji
Patent Applications and Registrations
Patent applications and USPTO patent grants for SHIRAI; Seiji.The latest application filed is for "printed circuit board".
Company Profile
0.30.24
- SHIRAI; Seiji - Ibi-gun JP
- Shirai; Seiji - Ibu-gun JP
- Shirai; Seiji - Gifu JP
Patent Activity
| Patent | Date |
|---|---|
| Printed Circuit Board App 20150250056 - INAGAKI; Yasushi ; et al. | 2015-09-03 |
| Printed circuit board Grant 9,060,446 - Inagaki , et al. June 16, 2 | 2015-06-16 |
| Multilayer printed wiring board with filled viahole structure Grant 8,987,603 - Shirai , et al. March 24, 2 | 2015-03-24 |
| Printed circuit board and method of manufacturing printed circuit board Grant 8,842,440 - Inagaki , et al. September 23, 2 | 2014-09-23 |
| Printed circuit board and method of manufacturing printed circuit board Grant 8,830,691 - Inagaki , et al. September 9, 2 | 2014-09-09 |
| Printed Circuit Board App 20140247572 - INAGAKI; Yasushi ; et al. | 2014-09-04 |
| Printed circuit board Grant 8,780,573 - Inagaki , et al. July 15, 2 | 2014-07-15 |
| Method of manufacturing printed wiring board Grant 8,763,241 - Inagaki , et al. July 1, 2 | 2014-07-01 |
| Printed circuit board Grant 8,717,772 - Inagaki , et al. May 6, 2 | 2014-05-06 |
| Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20130286615 - Inagaki; Yasushi ; et al. | 2013-10-31 |
| Printed Circuit Board App 20130107482 - INAGAKI; Yasushi ; et al. | 2013-05-02 |
| Printed circuit board Grant 8,331,102 - Inagaki , et al. December 11, 2 | 2012-12-11 |
| Multilayer Printed Wiring Board With Filled Viahole Structure App 20120103680 - SHIRAI; Seiji ; et al. | 2012-05-03 |
| Multilayer printed wiring board with filled viahole structure Grant 8,115,111 - Shirai , et al. February 14, 2 | 2012-02-14 |
| Printed circuit board Grant 8,116,091 - Inagaki , et al. February 14, 2 | 2012-02-14 |
| Printed circuit board Grant 8,107,253 - Inagaki , et al. January 31, 2 | 2012-01-31 |
| Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20120006469 - INAGAKI; YASUSHI ; et al. | 2012-01-12 |
| Printed circuit board Grant 7,995,352 - Inagaki , et al. August 9, 2 | 2011-08-09 |
| Printed circuit board Grant 7,978,478 - Inagaki , et al. July 12, 2 | 2011-07-12 |
| Printed circuit board Grant 7,881,069 - Inagaki , et al. February 1, 2 | 2011-02-01 |
| Printed circuit board Grant 7,864,543 - Inagaki , et al. January 4, 2 | 2011-01-04 |
| Printed circuit board Grant 7,864,542 - Inagaki , et al. January 4, 2 | 2011-01-04 |
| Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20100328915 - INAGAKI; Yasushi ; et al. | 2010-12-30 |
| Printed circuit board Grant 7,855,894 - Inagaki , et al. December 21, 2 | 2010-12-21 |
| Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20100226108 - INAGAKI; Yasushi ; et al. | 2010-09-09 |
| Multilayer printed wiring board with filled viahole structure Grant 7,737,366 - Shirai , et al. June 15, 2 | 2010-06-15 |
| Printed Circuit Board App 20100118502 - INAGAKI; Yasushi ; et al. | 2010-05-13 |
| Multilayer Printed Wiring Board With Filled Viahole Structure App 20100101852 - Shirai; Seiji ; et al. | 2010-04-29 |
| Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20100014261 - INAGAKI; Yasushi ; et al. | 2010-01-21 |
| Multilayer printed wiring board with filled viahole structure Grant 7,622,183 - Shirai , et al. November 24, 2 | 2009-11-24 |
| Multilayer Printed Wiring Board With Filled Viahole Structure App 20080264686 - SHIRAI; Seiji ; et al. | 2008-10-30 |
| Printed Circuit Board And Method Of Manufacturing Printed Ciruit Board App 20080169120 - Inagaki; Yasushi ; et al. | 2008-07-17 |
| Printed Circuit Board And Method For Manufacturing Printed Circuit Board App 20080158841 - INAGAKI; Yasushi ; et al. | 2008-07-03 |
| Printed Circuit Board And Method For Manufacturing Printed Circuit Board App 20080158838 - INAGAKI; Yasushi ; et al. | 2008-07-03 |
| Multilayer printed wiring board with filled viahole structure Grant 7,390,974 - Shirai , et al. June 24, 2 | 2008-06-24 |
| Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20080144298 - Inagaki; Yasushi ; et al. | 2008-06-19 |
| Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20080142255 - Inagaki; Yasushi ; et al. | 2008-06-19 |
| Printed circuit board and method of manufacturing printed circuit board Grant 7,342,803 - Inagaki , et al. March 11, 2 | 2008-03-11 |
| Printed Circuit Board And Method For Manufacturing Printed Circuit Board App 20080055872 - INAGAKI; Yasushi ; et al. | 2008-03-06 |
| Printed circuit board and method for manufacturing printed circuit board Grant 7,307,852 - Inagaki , et al. December 11, 2 | 2007-12-11 |
| Printed Circuit Board And Method Of Manufacturing Printed Ciruit Board App 20070258225 - Inagaki; Yasushi ; et al. | 2007-11-08 |
| Multilayer printed wiring board with filled viahole structure App 20060159885 - Shirai; Seiji ; et al. | 2006-07-20 |
| Multilayer printed wiring board having filled-via structure Grant 7,071,424 - Shirai , et al. July 4, 2 | 2006-07-04 |
| Printed circuit board and method for manufacturing printed circuit board App 20050157478 - Inagaki, Yasushi ; et al. | 2005-07-21 |
| Multilayer printed wiring board with filled viahole structure App 20050100720 - Shirai, Seiji ; et al. | 2005-05-12 |
| Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board Grant 6,876,554 - Inagaki , et al. April 5, 2 | 2005-04-05 |
| Printed circuit board and method of manufacturing printed circuit board App 20040160751 - Inagaki, Yasushi ; et al. | 2004-08-19 |
| Printed wiring board and method of producing the same Grant 6,724,638 - Inagaki , et al. April 20, 2 | 2004-04-20 |
| Multilayer printed wiring board Grant 6,365,843 - Shirai , et al. April 2, 2 | 2002-04-02 |
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