Shirai; Masaharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shirai; Masaharu.The latest application filed is for "circuit board and mounting structure".

Company Profile

0.15.5

Shirai; Masaharu - Yasu N/A JP
Shirai; Masaharu - Shiga JP
Shirai; Masaharu - Kanagawa JP
Shirai; Masaharu - Yasu-shi JP
Shirai; Masaharu - Minamiashigara JP
Shirai; Masaharu - Kusatsu JP
Shirai; Masaharu - Ohtsu JP
Shirai; Masaharu - Minami-ashigara JP
Shirai; Masaharu - Ebina JP
Shirai; Masaharu - Otsu JA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit board and mounting structure Grant 8,446,734 - Hayashi , et al. May 21, 2	2013-05-21
Resin film, adhesive sheet, circuit board, and electronic apparatus Grant 8,129,623 - Nagasawa , et al. March 6, 2	2012-03-06
Fiber-reinforced resin and method for manufacturing the same Grant 8,012,561 - Harazono , et al. September 6, 2	2011-09-06
Image forming apparatus having external-additive removal unit that includes a conductive blade Grant 7,945,191 - Shirai May 17, 2	2011-05-17
Circuit Board and Mounting Structure App 20100259910 - Hayashi; Katsura ; et al.	2010-10-14
Image Forming Apparatus App 20100247190 - SHIRAI; Masaharu	2010-09-30
Fiber-Reinforced Resin and Method for Manufacturing the Same App 20100136284 - Harazono; Masaaki ; et al.	2010-06-03
Image forming apparatus forming a developed image using an image carrier Grant 7,715,777 - Shirai , et al. May 11, 2	2010-05-11
Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus App 20090314526 - Nagasawa; Tadashi ; et al.	2009-12-24
Image forming apparatus App 20090035036 - Shirai; Masaharu ; et al.	2009-02-05
Method for manufacturing a built-up circuit board Grant 6,612,028 - Shirai September 2, 2	2003-09-02
Circuit board and fabrication method thereof Grant 6,048,465 - Shirai April 11, 2	2000-04-11
Method of forming a resin laying in a surface laminated circuit Grant 5,766,825 - Shirai , et al. June 16, 1	1998-06-16
Method of making substrate member having electrical lines and apertured insulating film Grant 5,517,756 - Shirai , et al. May 21, 1	1996-05-21
Printed circuit board with landless blind hole for connecting an upper wiring pattern to a lower wiring pattern Grant 5,510,580 - Shirai , et al. April 23, 1	1996-04-23
Electrophotographic photoreceptor Grant 5,403,692 - Yokokawa , et al. April 4, 1	1995-04-04
Substrate member having electric lines and apertured insulating film Grant 5,252,781 - Shirai , et al. October 12, 1	1993-10-12
Electric field transfer method and apparatus Grant 4,571,052 - Shirai February 18, 1	1986-02-18
Fire retardant thermoplastic polyester type block copolymer composition Grant 3,957,905 - Sumoto , et al. May 18, 1	1976-05-18

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