Shiotsuki; Sadamu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shiotsuki; Sadamu.The latest application filed is for "method of manufacturing molded article including component insert-molded in resin mixed with solid powder".
- Shiotsuki; Sadamu - Nishio N/A JP
- Shiotsuki; Sadamu - Nishio-shi JP
- Shiotsuki; Sadamu - Nishio-city JP
- Shiotsuki, Sadamu - Kariya-city JP
| Patent | Date |
|---|---|
| Method of manufacturing molded article including component insert-molded in resin mixed with solid powder Grant 8,840,821 - Soltani , et al. September 23, 2 | 2014-09-23 |
| Method of manufacturing molded article including component insert-molded in molding material mixed with solid powder Grant 8,840,822 - Soltani , et al. September 23, 2 | 2014-09-23 |
| Method Of Manufacturing Molded Article Including Component Insert-molded In Molding Material Mixed With Solid Powder App 20130032966 - Soltani; Bahman Hossini ; et al. | 2013-02-07 |
| Method Of Manufacturing Molded Article Including Component Insert-molded In Resin Mixed With Solid Powder App 20130032964 - SOLTANI; Bahman Hossini ; et al. | 2013-02-07 |
| Ultrasonic cleaning method and device Grant 7,757,701 - Shiotsuki , et al. July 20, 2 | 2010-07-20 |
| Ultrasonic cleaning method and device App 20070102020 - Shiotsuki; Sadamu ; et al. | 2007-05-10 |
| Brazing method for brass parts using copper solder App 20050236462 - Kanda, Kiichi ; et al. | 2005-10-27 |
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