Shiotsuki; Keizou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shiotsuki; Keizou.The latest application filed is for "insulated communication wire".

Company Profile

0.5.7

Shiotsuki; Keizou - Settsu JP
Shiotsuki; Keizou - Osaka JP
Shiotsuki; Keizou - Orangeburg NY US
Shiotsuki; Keizou - Settsu-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Tetrafluoroethylene/hexafluoropropylene copolymer, and electric wire Grant 11,021,556 - Isaka , et al. June 1, 2	2021-06-01
Insulated Communication Wire App 20200332037 - ISAKA; Tadaharu ; et al.	2020-10-22
Tetrafluoroethylene/hexafluoropropylene Copolymer, And Electric Wire App 20190177453 - Isaka; Tadaharu ; et al.	2019-06-13
Tetrafluoroethylene/hexafluoropropylene Copolymer, And Electric Wire App 20170008986 - ISAKA; Tadaharu ; et al.	2017-01-12
Tetrafluoroethylene/hexafluoropropylene copolymer and the production method thereof, and electrical wire Grant 9,012,580 - Kitahara , et al. April 21, 2	2015-04-21
Method Of Producing A Fluororesin Composition And Electrical Wire App 20130230645 - KITAHARA; Takahiro ; et al.	2013-09-05
Resin composition, method of producing same, and foam-insulated electric wire Grant 7,884,148 - Shiotsuki , et al. February 8, 2	2011-02-08
Tetrafluoroethylene/hexafluoropropylene Copolymer And The Production Method Thereof, And Electrical Wire App 20100314154 - Kitahara; Takahiro ; et al.	2010-12-16
Resin composition, process for production thereof, and foam-insulated electric wire Grant 7,241,826 - Shiotsuki , et al. July 10, 2	2007-07-10
Resin composition, method of producing same, and foam-insulated electric wire App 20070149671 - Shiotsuki; Keizou ; et al.	2007-06-28
Resin composition, process for production thereof, and foam-insulated electric wire App 20040198886 - Shiotsuki, Keizou ; et al.	2004-10-07

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