Shiota; Natsuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shiota; Natsuki.The latest application filed is for "electronic component pressing apparatus and electronic component testing apparatus".

Company Profile

0.3.5

Shiota; Natsuki - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interposer, socket, socket assembly, and wiring board assembly Grant 11,327,093 - Kawashima , et al. May 10, 2	2022-05-10
Electronic component pressing apparatus and electronic component testing apparatus Grant 11,300,609 - Kato , et al. April 12, 2	2022-04-12
Electronic component handling apparatus, electronic component testing apparatus, and socket Grant 11,287,468 - Shiota , et al. March 29, 2	2022-03-29
Electronic Component Pressing Apparatus And Electronic Component Testing Apparatus App 20220082613 - Kato; Yasuyuki ; et al.	2022-03-17
Electronic Component Testing Apparatus, Sockets, And Replacement Parts For Electronic Component Testing Apparatus App 20210190855 - Shiota; Natsuki ; et al.	2021-06-24
Electronic Component Handling Apparatus, Electronic Component Testing Apparatus, And Socket App 20210190856 - Shiota; Natsuki ; et al.	2021-06-24
Electronic Component Handling Apparatus, Electronic Component Testing Apparatus, And Socket App 20210194601 - Shiota; Natsuki ; et al.	2021-06-24
Interposer, Socket, Socket Assembly, And Wiring Board Assembly App 20200300890 - Kawashima; Takashi ; et al.	2020-09-24

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