Shiota; Junji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shiota; Junji.The latest application filed is for "semiconductor device and method of manufacturing the same".

Company Profile

0.12.9

Shiota; Junji - Hamura JP
SHIOTA; Junji - Tokyo JP
SHIOTA; Junji - Hamura-shi JP
Shiota; Junji - Akishima JP
Shiota; Junji - Tachikawa JP
Shiota; Junji - Nagoya JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of manufacturing the same Grant 9,607,861 - Shiota , et al. March 28, 2	2017-03-28
Semiconductor Device And Method Of Manufacturing The Same App 20160233111 - SHIOTA; Junji ; et al.	2016-08-11
Semiconductor device and manufacturing method of the same Grant 8,564,128 - Shiota October 22, 2	2013-10-22
Semiconductor device having sealing film and manufacturing method thereof Grant 8,354,349 - Shiota January 15, 2	2013-01-15
Semiconductor device having low dielectric constant film and manufacturing method thereof Grant 8,154,133 - Koroku , et al. April 10, 2	2012-04-10
Semiconductor Device And Manufacturing Method Of The Same App 20120074564 - SHIOTA; Junji	2012-03-29
Semiconductor device capable of suppressing warping in a wafer state and manufacturing method thereof Grant 7,863,750 - Shiota , et al. January 4, 2	2011-01-04
Semiconductor Device Having Sealing Film And Manufacturing Method Thereof App 20100173455 - Shiota; Junji	2010-07-08
Method Of Manufacturing Semiconductor Device In Which Bottom Surface And Side Surface Of Semiconductor Substrate Are Covered With Resin Protective Film App 20100144095 - KOROKU; Taisuke ; et al.	2010-06-10
Method Of Manufacturing Semiconductor Device In Which Bottom Surface And Side Surface Of Semiconductor Substrate Are Covered With Resin Protective Film App 20100144097 - KOROKU; TAISUKE ; et al.	2010-06-10
Method Of Manufacturing Semiconductor Device In Which Bottom Surface And Side Surface Of Semiconductor Substrate Are Covered With Resin Protective Film App 20100144096 - Koroku; Taisuke ; et al.	2010-06-10
Semiconductor Device Capable Of Suppressing Warping In A Wafer State And Manufacturing Method Thereof App 20100019371 - SHIOTA; Junji ; et al.	2010-01-28
Semiconductor Device Having Low Dielectric Constant Film And Manufacturing Method Thereof App 20090243097 - KOROKU; Taisuke ; et al.	2009-10-01
Semiconductor device having sealing film and manufacturing method thereof App 20080073785 - Shiota; Junji	2008-03-27
Method of manufacturing ink-jet printer head Grant 6,473,966 - Kohno , et al. November 5, 2	2002-11-05
Substrate with conductor formed of low-resistance aluminum alloy Grant 6,320,138 - Kamiya , et al. November 20, 2	2001-11-20
Sputtering apparatus Grant 5,514,259 - Shiota , et al. May 7, 1	1996-05-07
End separating device for sheet having a backing paper Grant 5,259,681 - Kitazawa , et al. November 9, 1	1993-11-09
Method of forming transparent conductive film and apparatus for forming the same Grant 4,975,168 - Ohno , et al. December 4, 1	1990-12-04

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