Shiomi; Takashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shiomi; Takashi.The latest application filed is for "substrate bonding device, calculation device, substrate bonding method, and calculation method".

Company Profile

0.3.5

Shiomi; Takashi - Nisshin JP
SHIOMI; Takashi - Yokohama-shi JP
SHIOMI; Takashi - Nisshin-shi JP
Shiomi; Takashi - Osaka JP
Shiomi; Takashi - Osaka-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mobile unit, information processing method, and program Grant 11,410,197 - Takahashi , et al. August 9, 2	2022-08-09
Substrate Bonding Device, Calculation Device, Substrate Bonding Method, And Calculation Method App 20210242044 - MITSUISHI; Hajime ; et al.	2021-08-05
Information Processing Apparatus, Information Processing Method And Information Processing System App 20210235025 - TAKAHASHI; Kentaro ; et al.	2021-07-29
Mobile Unit, Information Processing Method, And Program App 20210166273 - TAKAHASHI; Kentaro ; et al.	2021-06-03
Heat resistant capsule and process for producing the same Grant 7,842,384 - Kamaguchi , et al. November 30, 2	2010-11-30
Non-gelatinous capsule shell composition and a capsule formed from the same Grant 7,255,921 - Kamaguchi , et al. August 14, 2	2007-08-14
Thermostable capsule and process for producing the same (as amended) App 20060286282 - Kamaguchi; Ryosei ; et al.	2006-12-21
Non-gelatinous capsule film compositions and capsules using the same App 20050069579 - Kamaguchi, Ryosei ; et al.	2005-03-31

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