| Patent | Date |
|---|
Resin Substrate Having Dielectric Characteristics With Little Frequency Dependence
App 20220275158 - SHIOBARA; Toshio ; et al. | 2022-09-01 |
Low Dielectric Substrate For High-speed Millimeter-wave Communication
App 20220248526 - SHIOBARA; Toshio ; et al. | 2022-08-04 |
Low Dielectric Resin Substrate
App 20210403672 - SHIOBARA; Toshio ; et al. | 2021-12-30 |
Annealed Quartz Glass Cloth And Method For Manufacturing Same
App 20210395929 - SHIOBARA; Toshio ; et al. | 2021-12-23 |
Low Dielectric Silica Powder, Resin Composition Containing The Silica Powder, And Method For Manufacturing Low Dielectric Silica Powder
App 20210371666 - SHIOBARA; Toshio ; et al. | 2021-12-02 |
Adhesive substrate, transfer device having adhesive substrate, and method for producing adhesive substrate
Grant 10,818,618 - Iguchi , et al. October 27, 2 | 2020-10-27 |
Concentrating solar cell module
Grant 10,763,384 - Goto , et al. Sep | 2020-09-01 |
Substrate and semiconductor apparatus
Grant 10,743,412 - Akahane , et al. A | 2020-08-11 |
Surface-modified glass fiber film
Grant 10,669,197 - Akahane , et al. | 2020-06-02 |
Anisotropic Film And Method For Manufacturing Anisotropic Film
App 20200156291 - IGUCHI; Hiroyuki ; et al. | 2020-05-21 |
Adhesive Substrate, Transfer Device Having Adhesive Substrate, And Method For Producing Adhesive Substrate
App 20200035627 - IGUCHI; Hiroyuki ; et al. | 2020-01-30 |
Quartz Glass Fiber-containing Prepreg, Quartz Glass Fiber-containing Film And Quartz Glass Fiber-containing Substrate
App 20190225762 - TSUTSUMI; Yoshihiro ; et al. | 2019-07-25 |
Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof
Grant 10,308,803 - Shiobara , et al. | 2019-06-04 |
Anisotropic Conductive Film And Method For Manufacturing Anisotropic Conductive Film
App 20190100663 - IGUCHI; Hiroyuki ; et al. | 2019-04-04 |
Base-attached encapsulant for semiconductor encapsulation, semiconductor apparatus
Grant 10,242,924 - Nakamura , et al. | 2019-03-26 |
Method for manufacturing semiconductor apparatus using a base-attached encapsulant
Grant 10,177,059 - Nakamura , et al. J | 2019-01-08 |
Method for producing concentrating solar cell module and concentrating solar cell module
Grant 10,134,934 - Goto , et al. November 20, 2 | 2018-11-20 |
Concentrating Solar Cell Module
App 20180309007 - GOTO; Wataru ; et al. | 2018-10-25 |
Method For Manufacturing Semiconductor Apparatus
App 20180247834 - TSUDA; Koichi ; et al. | 2018-08-30 |
Silicone-organic Resin Composite Laminate And Manufacturing Method Thereof, And Light-emitting Semiconductor Apparatus Using The Same
App 20180190890 - YAMAGUCHI; Shigeo ; et al. | 2018-07-05 |
Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same
Grant 9,963,542 - Shiobara , et al. May 8, 2 | 2018-05-08 |
Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof
Grant 9,944,760 - Shiobara , et al. April 17, 2 | 2018-04-17 |
Method for producing surface-treated glass fiber film and flexible fiber substrate
Grant 9,902,649 - Hamamoto , et al. February 27, 2 | 2018-02-27 |
Base-attached Encapsulant For Semiconductor Encapsulation, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus
App 20180025958 - NAKAMURA; Tomoaki ; et al. | 2018-01-25 |
Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus
Grant 9,865,518 - Akiba , et al. January 9, 2 | 2018-01-09 |
Base-attached Encapsulant For Semiconductor Encapsulation, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus
App 20170330813 - NAKAMURA; Tomoaki ; et al. | 2017-11-16 |
Vacuum Laminating Apparatus And Method For Manufacturing Semiconductor Apparatus
App 20170282527 - AKIBA; Hideki ; et al. | 2017-10-05 |
Silicone-modified epoxy resin and composition and cured article thereof
Grant 9,777,107 - Shiobara , et al. October 3, 2 | 2017-10-03 |
Method For Manufacturing Semiconductor Apparatus And Semiconductor Apparatus
App 20170110415 - NAKAMURA; Tomoaki ; et al. | 2017-04-20 |
Silicone-modified Epoxy Resin, Composition Containing The Epoxy Resin, And Cured Product Of Same
App 20170107322 - Shiobara; Toshio ; et al. | 2017-04-20 |
Base-attached Encapsulant For Semiconductor Encapsulation, Method For Manufacturing Base-attached Encapsulant For Semiconductor Encapsulation, And Method For Manufacturing Semiconductor Apparatus
App 20170098551 - NAKAMURA; Tomoaki ; et al. | 2017-04-06 |
Silicone-modified Epoxy Resin, Composition Containing Said Epoxy Resin, And Cured Product Thereof
App 20170073457 - Shiobara; Toshio ; et al. | 2017-03-16 |
Composite particle, method of producing same, resin composition containing the particle, reflector formed from the composition, and light-emitting semiconductor device using the reflector
Grant 9,463,997 - Shiobara , et al. October 11, 2 | 2016-10-11 |
Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus
Grant 9,449,856 - Nakamura , et al. September 20, 2 | 2016-09-20 |
Silicone-modified Epoxy Resin And Composition And Cured Article Thereof
App 20160237202 - Shiobara; Toshio ; et al. | 2016-08-18 |
Semiconductor apparatus and method for producing the same
Grant 9,401,290 - Shiobara , et al. July 26, 2 | 2016-07-26 |
UV- and heat-resistant optoelectronic semiconductor component
Grant 9,397,271 - Jaeger , et al. July 19, 2 | 2016-07-19 |
Epoxy Resin Containing Silicone-Modified Epoxy Resin and Polyvalent Carboxylic Acid Compound, and Cured Product Thereof
App 20160177085 - Shiobara; Toshio ; et al. | 2016-06-23 |
Method For Manufacturing Semiconductor Apparatus And Semiconductor Apparatus
App 20160141268 - NAKAMURA; Tomoaki ; et al. | 2016-05-19 |
Electromagnetic Wave Shielding Support Base-attached Encapsulant, Encapsulated Substrate Having Semicondutor Devices Mounted Thereon, Encapsulated Wafer Having Semiconductor Devices Formed Thereon, And Semiconductor Apparatus
App 20160133579 - AKIBA; Hideki ; et al. | 2016-05-12 |
Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus
Grant 9,312,197 - Akiba , et al. April 12, 2 | 2016-04-12 |
Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus
Grant 9,287,174 - Sekiguchi , et al. March 15, 2 | 2016-03-15 |
UV-curable adhesive silicone composition, UV-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same
Grant 9,268,227 - Kashiwagi , et al. February 23, 2 | 2016-02-23 |
Electromagnetic Wave Shielding Sheet And Semiconductor Apparatus
App 20160044839 - AKAHANE; Saiko ; et al. | 2016-02-11 |
Fiber-containing Resin Substrate, Device-mounting Substrate And Device-forming Wafer, Semiconductor Apparatus, And Method For Producing Semiconductor Apparatus
App 20160043012 - SEKIGUCHI; Susumu ; et al. | 2016-02-11 |
Support Base-attached Encapsulant, Encapsulated Substrate Having Semiconductor Devices Mounted Thereon, Encapsulated Wafer Having Semiconductor Devices Formed Thereon, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus
App 20160035638 - AKIBA; Hideki ; et al. | 2016-02-04 |
Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
Grant 9,240,332 - Sekiguchi , et al. January 19, 2 | 2016-01-19 |
Method For Producing Surface-treated Glass Fiber Film And Flexible Fiber Substrate
App 20150315073 - HAMAMOTO; Yoshihira ; et al. | 2015-11-05 |
Wavelength conversion sheet filled with large amount of phosphor, method of producing light emitting semiconductor device using the sheet, and light emitting semiconductor device
Grant 9,147,818 - Shiobara , et al. September 29, 2 | 2015-09-29 |
Uv-curable Adhesive Silicone Composition, Uv-curable Adhesive Silicone Composition Sheet, Optical Semiconductor Apparatus And Method For Manufacturing The Same
App 20150261088 - KASHIWAGI; Tsutomu ; et al. | 2015-09-17 |
Method of manufacturing semiconductor apparatus and semiconductor apparatus
Grant 9,129,976 - Akiba , et al. September 8, 2 | 2015-09-08 |
Encapsulant, encapsulated substrate having semiconductor devices mounting thereon, encapsulated wafer having semiconductor devices forming thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus
Grant 9,129,912 - Akiba , et al. September 8, 2 | 2015-09-08 |
Substrate And Semiconductor Apparatus
App 20150245476 - AKAHANE; Saiko ; et al. | 2015-08-27 |
Thermosetting silicone resin sheet and method for producing the same, and light-emitting apparatus using the thermosetting silicone resin sheet and method for producing the same
Grant 9,117,978 - Kashiwagi , et al. August 25, 2 | 2015-08-25 |
Vacuum Laminating Apparatus And Method For Manufacturing Semiconductor Apparatus
App 20150235871 - AKIBA; Hideki ; et al. | 2015-08-20 |
Surface-modified Glass Fiber Film
App 20150197885 - AKAHANE; Saiko ; et al. | 2015-07-16 |
Siloxane-grafted silica, transparent silicone composition, and optoelectronic device encapsulated therewith
Grant 9,074,101 - Tsubokawa , et al. July 7, 2 | 2015-07-07 |
Composite Particle, Method Of Producing Same, Resin Composition Containing The Particle, Reflector Formed From The Composition, And Light-emitting Semiconductor Device Using The Reflector
App 20150060919 - SHIOBARA; Toshio ; et al. | 2015-03-05 |
Composite Particle, Method Of Producing Same, Resin Composition Containing The Particle, Reflector Formed From The Composition, And Light-emitting Semiconductor Device Using The Reflector
App 20150060918 - SHIOBARA; Toshio ; et al. | 2015-03-05 |
Encapsulant With Base For Use In Semiconductor Encapsulation, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus
App 20150028497 - NAKAMURA; Tomoaki ; et al. | 2015-01-29 |
Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatus
Grant 8,933,158 - Shiobara , et al. January 13, 2 | 2015-01-13 |
Fiber-containing Resin Substrate, Sealed Substrate Having Semiconductor Device Mounted Thereon, Sealed Wafer Having Semiconductor Device Formed Thereon, A Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus
App 20140329363 - SEKIGUCHI; Susumu ; et al. | 2014-11-06 |
Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatus
Grant 8,877,849 - Shiobara , et al. November 4, 2 | 2014-11-04 |
Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
Grant 8,872,358 - Shiobara , et al. October 28, 2 | 2014-10-28 |
Surface-mount light emitting device
Grant 8,846,420 - Shiobara , et al. September 30, 2 | 2014-09-30 |
Heat-curable silicone resin sheet having phosphor-containing layer and phosphor-free layer, method of producing light emitting device utilizing same and light emitting semiconductor device obtained by the method
Grant 8,841,689 - Kashiwagi , et al. September 23, 2 | 2014-09-23 |
Sealant Laminated Composite, Sealed Semiconductor Devices Mounting Substrate, Sealed Semiconductor Devices Forming Wafer, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus
App 20140264956 - SHIOBARA; Toshio ; et al. | 2014-09-18 |
Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
Grant 8,823,186 - Sekiguchi , et al. September 2, 2 | 2014-09-02 |
Silicone resin composition, luminous substance-containing wavelength-converting film, and cured product thereof
Grant 8,809,480 - Kusunoki , et al. August 19, 2 | 2014-08-19 |
Method For Producing Concentrating Solar Cell Module And Concentrating Solar Cell Module
App 20140224299 - GOTO; Wataru ; et al. | 2014-08-14 |
Silicone-organic Resin Composite Laminate And Manufacturing Method Thereof, And Light-emitting Semiconductor Apparatus Using The Same
App 20140199909 - YAMAGUCHI; Shigeo ; et al. | 2014-07-17 |
Concentrating Solar Cell Module And Method For Producing Concentrating Solar Cell Module
App 20140182657 - GOTO; Wataru ; et al. | 2014-07-03 |
Silicone laminated substrate, method of producing same, silicone resin composition for producing silicone laminated substrate, and LED device
Grant 8,765,264 - Kashiwagi , et al. July 1, 2 | 2014-07-01 |
Heat-curable Silicone Resin Sheet Having Phosphor-containing Layer And White Pigment-containing Layer, Method Of Producing Light Emitting Device Using Same And Encapsulated Light Emitting Semiconductor Device Produced Thereby
App 20140175488 - KASHIWAGI; Tsutomu ; et al. | 2014-06-26 |
Addition reaction-curable organopolysilmethylenesiloxane copolymer composition
Grant 8,759,456 - Shiobara , et al. June 24, 2 | 2014-06-24 |
Fiber-containing Resin Substrate, Device-mounting Substrate And Device-forming Wafer, Semiconductor Apparatus, And Method For Producing Semiconductor Apparatus
App 20140138856 - SEKIGUCHI; Susumu ; et al. | 2014-05-22 |
Encapsulant Equipped With Supporting Substrate, Encapsulated Substrate Having Semiconductor Devices Mounting Thereon, Encapsulated Wafer Having Semiconductor Devices Forming Thereon, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus
App 20140138857 - AKIBA; Hideki ; et al. | 2014-05-22 |
Thermosetting Silicone Resin Sheet And Method For Producing The Same, And Light-emitting Apparatus Using The Thermosetting Silicone Resin Sheet And Method For Producing The Same
App 20140124809 - KASHIWAGI; Tsutomu ; et al. | 2014-05-08 |
Method Of Manufacturing Semiconductor Apparatus And Semiconductor Apparatus
App 20140091483 - AKIBA; Hideki ; et al. | 2014-04-03 |
Resin composition for encapsulating optical semiconductor element and optical semiconductor device
Grant 8,610,293 - Shiobara , et al. December 17, 2 | 2013-12-17 |
Surface-Mount Light Emitting Device
App 20130312906 - SHIOBARA; Toshio ; et al. | 2013-11-28 |
Thermosetting Silicone Resin Composition For Reflector Of Led, Reflector For Led Using The Same And Optical Semiconductor Apparatus
App 20130274398 - SHIOBARA; Toshio ; et al. | 2013-10-17 |
Thermosetting Silicone Resin Composition For Reflector Of Led, Reflector For Led Using The Same And Optical Semiconductor Apparatus
App 20130271999 - SHIOBARA; Toshio ; et al. | 2013-10-17 |
Semiconductor Apparatus And Method For Producing The Same
App 20130241087 - SHIOBARA; Toshio ; et al. | 2013-09-19 |
Organopolysilmethylene-siloxane And A Cured Product Thereof
App 20130231452 - UENO; Manabu ; et al. | 2013-09-05 |
Sealant Laminated Composite, Sealed Semiconductor Devices Mounting Substrate, Sealed Semiconductor Devices Forming Wafer, Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus
App 20130200534 - SHIOBARA; Toshio ; et al. | 2013-08-08 |
Heat-curable Silicone Resin Sheet Having Phosphor-containing Layer And Phosphor-free Layer, Method Of Producing Light Emitting Device Utilizing Same And Light Emitting Semiconductor Device Obtained By The Method
App 20130200413 - KASHIWAGI; Tsutomu ; et al. | 2013-08-08 |
Phosphor-containing Adhesive Silicone Composition Sheet, And Method Of Producing Light-emitting Device Using Same
App 20130200425 - KASHIWAGI; Tsutomu ; et al. | 2013-08-08 |
Organopolysilmethylene-siloxane and a cured product thereof
Grant 8,497,024 - Ueno , et al. July 30, 2 | 2013-07-30 |
Silicone Resin Composition, Luminous Substance-containing Wavelength-converting Film, And Cured Product Thereof
App 20130181167 - KUSUNOKI; Takayuki ; et al. | 2013-07-18 |
Uv-curable Adhesive Silicone Composition, Uv-curable Adhesive Silicone Composition Sheet, Optical Semiconductor Apparatus And Method For Manufacturing The Same
App 20130183776 - KASHIWAGI; Tsutomu ; et al. | 2013-07-18 |
Resin composition, reflector for light-emitting semiconductor device, and light-emitting semiconductor unit
Grant 8,455,899 - Taguchi , et al. June 4, 2 | 2013-06-04 |
Lens-forming silicone resin composition and silicone lens
Grant 8,440,776 - Kashiwagi , et al. May 14, 2 | 2013-05-14 |
Wavelength Conversion Sheet Filled With Large Amount Of Phosphor, Method Of Producing Light Emitting Semiconductor Device Using The Sheet, And Light Emitting Semiconductor Device
App 20130113008 - SHIOBARA; Toshio ; et al. | 2013-05-09 |
Surface-mount Light Emitting Device
App 20130026522 - SHIOBARA; Toshio ; et al. | 2013-01-31 |
Light-emitting semiconductor device, mounted substrate, and fabrication method thereof
Grant 8,319,242 - Shiobara , et al. November 27, 2 | 2012-11-27 |
Addition Reaction-curable Organopolysilmethylenesiloxane Copolymer Composition
App 20120220722 - SHIOBARA; Toshio ; et al. | 2012-08-30 |
Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same
Grant 8,237,189 - Taguchi , et al. August 7, 2 | 2012-08-07 |
Fiber-containing Resin Substrate, Sealed Substrate Having Semiconductor Device Mounted Thereon, Sealed Wafer Having Semiconductor Device Formed Thereon, A Semiconductor Apparatus, And Method For Manufacturing Semiconductor Apparatus
App 20120161339 - SEKIGUCHI; Susumu ; et al. | 2012-06-28 |
Organopolysilmethylene and a composition comprising the same
Grant 8,173,759 - Kashiwagi , et al. May 8, 2 | 2012-05-08 |
Resin composition for encapsulating optical semiconductor element
Grant 8,133,957 - Hamamoto , et al. March 13, 2 | 2012-03-13 |
Isocyanuric ring-containing polysiloxane having vinyl groups at the terminals
Grant 8,124,715 - Tanaka , et al. February 28, 2 | 2012-02-28 |
Light-emitting Semiconductor Device, Mounted Substrate, And Fabrication Method Thereof
App 20120007119 - SHIOBARA; Toshio ; et al. | 2012-01-12 |
Heat-curable resin composition
Grant 8,088,856 - Shiobara , et al. January 3, 2 | 2012-01-03 |
Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device
Grant 8,057,906 - Kashiwagi , et al. November 15, 2 | 2011-11-15 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 8,048,969 - Osada , et al. November 1, 2 | 2011-11-01 |
Resin resolution composition, polyimide resin, and semiconductor device
Grant 8,034,893 - Akiba , et al. October 11, 2 | 2011-10-11 |
Resin Composition, Reflector For Light-emitting Semiconductor Device, And Light-emitting Semiconductor Unit
App 20110241048 - TAGUCHI; Yusuke ; et al. | 2011-10-06 |
Silicone resin for protecting a light transmitting surface of an optoelectronic device
Grant 8,017,246 - Morita , et al. September 13, 2 | 2011-09-13 |
Diglycidylisocyanuryl-modified organopolysiloxane and composition containing the same
Grant 7,985,806 - Shiobara , et al. July 26, 2 | 2011-07-26 |
Resin Composition For Encapsulating Optical Semiconductor Element And Optical Semiconductor Device
App 20110140289 - SHIOBARA; Toshio ; et al. | 2011-06-16 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 7,943,706 - Kimura , et al. May 17, 2 | 2011-05-17 |
Isocyanuric Ring-containing Polysiloxane Having Vinyl Groups At The Terminals
App 20110105713 - TANAKA; Hayato ; et al. | 2011-05-05 |
Organopolysilmethylene And A Composition Comprising The Same
App 20110046310 - KASHIWAGI; Tsutomu ; et al. | 2011-02-24 |
Organopolysilmethylene And A Cured Product Thereof
App 20110046319 - Ueno; Manabu ; et al. | 2011-02-24 |
Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet
Grant 7,858,198 - Kashiwagi , et al. December 28, 2 | 2010-12-28 |
Lens-forming silicone resin composition and silicone lens
Grant 7,829,651 - Shiobara , et al. November 9, 2 | 2010-11-09 |
Semiconductor device encapsulated by silicone resin composition, and silicone resin tablet for encapsulating semiconductor device
Grant 7,807,736 - Kashiwagi , et al. October 5, 2 | 2010-10-05 |
Lens-forming Silicone Resin Composition And Silicone Lens
App 20100197870 - Kashiwagi; Tsutomu ; et al. | 2010-08-05 |
Silicone lens and silicone resin composition for molding lens
Grant 7,737,194 - Kashiwagi , et al. June 15, 2 | 2010-06-15 |
Heat-curable Resin Composition
App 20100125116 - Shiobara; Toshio ; et al. | 2010-05-20 |
Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device
Grant 7,714,080 - Akiba , et al. May 11, 2 | 2010-05-11 |
Thermosetting Epoxy Resin Composition And Semiconductor Device
App 20100104794 - Aoki; Takayuki ; et al. | 2010-04-29 |
Phosphor-filled curable silicone resin composition and cured product thereof
Grant 7,705,093 - Kashiwagi , et al. April 27, 2 | 2010-04-27 |
Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymer
Grant 7,683,152 - Akiba , et al. March 23, 2 | 2010-03-23 |
Silicone Laminated Substrate, Method Of Producing Same, Silicone Resin Composition For Producing Silicone Laminated Substrate, And Led Device
App 20100065880 - KASHIWAGI; Tsutomu ; et al. | 2010-03-18 |
Resin Composition For Encapsulating Optical Semiconductor Element
App 20100029887 - Hamamoto; Yoshihira ; et al. | 2010-02-04 |
Heat-curable Silicone Resin-epoxy Resin Composition, And Premolded Package Molded From Same
App 20100001311 - Taguchi; Yusuke ; et al. | 2010-01-07 |
Diglycidylisocyanuryl-modified Organopolysiloxane And Composition Containing The Same
App 20090203822 - SHIOBARA; Toshio ; et al. | 2009-08-13 |
Liquid epoxy resin composition and flip chip semiconductor device
App 20090184431 - Sumita; Kazuaki ; et al. | 2009-07-23 |
Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof
Grant 7,563,854 - Shimizu , et al. July 21, 2 | 2009-07-21 |
Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
Grant 7,550,204 - Shimizu , et al. June 23, 2 | 2009-06-23 |
Siloxane-grafted Silica, Transparent Silicone Composition, And Optoelectronic Device Encapsulated Therewith
App 20090121180 - TSUBOKAWA; Norio ; et al. | 2009-05-14 |
Silicone Resin for Protecting a Light Transmitting Surface of an Optoelectronic Device
App 20090123764 - Morita; Yasumasa ; et al. | 2009-05-14 |
Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device
Grant 7,521,813 - Kashiwagi , et al. April 21, 2 | 2009-04-21 |
Epoxy/silicone mixed resin composition and light-emitting semiconductor device
Grant 7,498,085 - Kashiwagi , et al. March 3, 2 | 2009-03-03 |
Phosphor-containing adhesive silicone composition, composition sheet formed of the composition, and method of producing light emitting device using the sheet
App 20080308828 - Kashiwagi; Tsutomu ; et al. | 2008-12-18 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 7,432,603 - Asano , et al. October 7, 2 | 2008-10-07 |
Adhesive composition and adhesive film
Grant 7,364,797 - Kozakai , et al. April 29, 2 | 2008-04-29 |
Conductive adhesive composition
Grant 7,345,105 - Yoshino , et al. March 18, 2 | 2008-03-18 |
Semiconductor Device Encapsulated By Silicone Resin Composition, And Silicone Resin Tablet For Encapsulating Semiconductor Device
App 20080021136 - KASHIWAGI; Tsutomu ; et al. | 2008-01-24 |
Phosphor-filled Curable Silicone Resin Composition And Cured Product Thereof
App 20070293623 - KASHIWAGI; Tsutomu ; et al. | 2007-12-20 |
Silicone lens and silicone resin composition for molding lens
App 20070249790 - Kashiwagi; Tsutomu ; et al. | 2007-10-25 |
Optical waveguide forming material and method
Grant 7,283,715 - Kodama , et al. October 16, 2 | 2007-10-16 |
Epoxy-silicone mixed resin composition and light-emitting semiconductor device
Grant 7,276,562 - Kashiwagi , et al. October 2, 2 | 2007-10-02 |
Dicing/die bonding adhesion tape
Grant 7,244,495 - Kozakai , et al. July 17, 2 | 2007-07-17 |
Radiation curing silicone rubber composition, adhesive silicone elastomer film formed from same, semiconductor device using same, and method of producing semiconductor device
Grant 7,241,823 - Kashiwagi , et al. July 10, 2 | 2007-07-10 |
Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof
App 20070099008 - Shimizu; Hisashi ; et al. | 2007-05-03 |
Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
App 20070099009 - Shimizu; Hisashi ; et al. | 2007-05-03 |
Method of reducing surface tackiness of silicone rubber cured product, liquid silicone rubber composition for sealing semiconductor, silicone rubber-sealed semiconductor device, and method of producing semiconductor device
App 20070077360 - Kashiwagi; Tsutomu ; et al. | 2007-04-05 |
Resin solution composition, polyimide resin, and semiconductor device
App 20070066796 - Akiba; Hideki ; et al. | 2007-03-22 |
Epoxy resin composition and semiconductor device
App 20070029682 - Aoki; Takayuki ; et al. | 2007-02-08 |
Liquid epoxy resin composition and semiconductor device
Grant 7,169,833 - Sumita , et al. January 30, 2 | 2007-01-30 |
Wafer dicing/die bonding sheet
Grant 7,147,920 - Shiobara , et al. December 12, 2 | 2006-12-12 |
Epoxy-silicone mixed resin composition, cured article thereof, and light-emitting semiconductor device
App 20060270808 - Imazawa; Katsuyuki ; et al. | 2006-11-30 |
Resin composition for sealing optical device and cured product thereof
App 20060270786 - Shimizu; Hisashi ; et al. | 2006-11-30 |
Lens-forming silicone resin composition and silicone lens
App 20060264583 - Kashiwagi; Tsutomu ; et al. | 2006-11-23 |
Lens-forming silicone resin composition and silicone lens
App 20060264567 - Shiobara; Toshio ; et al. | 2006-11-23 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
App 20060241250 - Osada; Shoichi ; et al. | 2006-10-26 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
App 20060241215 - Osada; Shoichi ; et al. | 2006-10-26 |
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
Grant 7,122,587 - Shimoda , et al. October 17, 2 | 2006-10-17 |
Curable resin composition for sealing LED element
App 20060229408 - Shimizu; Hisashi ; et al. | 2006-10-12 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
App 20060216519 - Kimura; Yasuo ; et al. | 2006-09-28 |
Liquid epoxy resin composition and semiconductor device
App 20060204762 - Sumita; Kazuaki ; et al. | 2006-09-14 |
Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device
App 20060199923 - Akiba; Hideki ; et al. | 2006-09-07 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 7,095,125 - Osada , et al. August 22, 2 | 2006-08-22 |
Liquid epoxy resin composition and semiconductor device
Grant 7,094,844 - Sumita , et al. August 22, 2 | 2006-08-22 |
Liquid epoxy resin composition and semiconductor device
Grant 7,067,930 - Sumita , et al. June 27, 2 | 2006-06-27 |
Heat resistant resin composition and adhesive film
Grant 7,060,786 - Ichiroku , et al. June 13, 2 | 2006-06-13 |
Method for sealing semiconductor component
Grant 7,056,772 - Shiobara , et al. June 6, 2 | 2006-06-06 |
Optical waveguide, forming material and making method
Grant 7,031,591 - Kodama , et al. April 18, 2 | 2006-04-18 |
Conductive resin composition
Grant 7,026,382 - Akiba , et al. April 11, 2 | 2006-04-11 |
Resin composition for sealing LED elements and cured product generated by curing the composition
App 20060035092 - Shimizu; Hisashi ; et al. | 2006-02-16 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
App 20050267236 - Asano, Eiichi ; et al. | 2005-12-01 |
Partial block polyimide-polysiloxane copolymer, making method , and resin composition comprising the copolymer
App 20050261456 - Akiba, Hideki ; et al. | 2005-11-24 |
Epoxy-silicone mixed resin composition and light-emitting semiconductor device
App 20050244649 - Kashiwagi, Tsutomu ; et al. | 2005-11-03 |
Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition
Grant 6,949,619 - Ichiroku , et al. September 27, 2 | 2005-09-27 |
Radiation curing silicone rubber composition and adhesive silicone elastomer film
Grant 6,949,294 - Kashiwagi , et al. September 27, 2 | 2005-09-27 |
Epoxy/silicone mixed resin composition and light-emitting semiconductor device
App 20050129957 - Kashiwagi, Tsutomu ; et al. | 2005-06-16 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 6,894,091 - Osada , et al. May 17, 2 | 2005-05-17 |
Adhesive composition and adhesive film
App 20050065296 - Kozakai, Shouhei ; et al. | 2005-03-24 |
Optical waveguide forming material and method
App 20050025442 - Kodama, Kinya ; et al. | 2005-02-03 |
Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device
App 20050006794 - Kashiwagi, Tsutomu ; et al. | 2005-01-13 |
Method for sealing semiconductor component
App 20050009244 - Shiobara, Toshio ; et al. | 2005-01-13 |
Liquid epoxy resin composition and flip chip semiconductor device
App 20040227255 - Sumita, Kazuaki ; et al. | 2004-11-18 |
Dicing/die bonding adhesion tape
App 20040213994 - Kozakai, Shouhei ; et al. | 2004-10-28 |
Heat resistant resin composition and adhesive film
Grant 6,808,819 - Ichiroku , et al. October 26, 2 | 2004-10-26 |
Light-emitting semiconductor potting composition and light-emitting semiconductor device
Grant 6,806,509 - Yoshino , et al. October 19, 2 | 2004-10-19 |
Liquid epoxy resin composition and semiconductor device
App 20040192810 - Sumita, Kazuaki ; et al. | 2004-09-30 |
Flip-chip type semiconductor device
Grant 6,794,058 - Honda , et al. September 21, 2 | 2004-09-21 |
Light-emitting Semiconductor Potting Composition And Light-emitting Semiconductor Device
App 20040178509 - Yoshino, Masachika ; et al. | 2004-09-16 |
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
Grant 6,783,859 - Osada , et al. August 31, 2 | 2004-08-31 |
Liquid epoxy resin composition and semiconductor device
Grant 6,780,674 - Sumita , et al. August 24, 2 | 2004-08-24 |
Conductive adhesive composition
App 20040127626 - Yoshiko, Masachiko ; et al. | 2004-07-01 |
Radiation curing silicone rubber composition, adhesive silicone elastomer film formed from same, semiconductor device using same, and method of producing semiconductor device
App 20040127613 - Kashiwagi, Tsutomu ; et al. | 2004-07-01 |
Wafer dicing/die bonding sheet
App 20040105990 - Shiobara, Toshio ; et al. | 2004-06-03 |
Liquid epoxy resin composition and semiconductor device
Grant 6,733,902 - Sumita , et al. May 11, 2 | 2004-05-11 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 6,723,452 - Kimura , et al. April 20, 2 | 2004-04-20 |
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
App 20040072968 - Shimoda, Tarou ; et al. | 2004-04-15 |
Optical device-related adhesive and optical device
Grant 6,709,756 - Kuwabara , et al. March 23, 2 | 2004-03-23 |
Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith
Grant 6,709,753 - Honda , et al. March 23, 2 | 2004-03-23 |
Liquid epoxy resin composition and semiconductor device
App 20040054061 - Sumita, Kazuaki ; et al. | 2004-03-18 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
App 20040034161 - Osada, Shoichi ; et al. | 2004-02-19 |
Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition
App 20040019174 - Ichiroku, Nobuhiro ; et al. | 2004-01-29 |
Optical waveguide, forming material and making method
App 20040017994 - Kodama, Kinya ; et al. | 2004-01-29 |
Liquid epoxy resin composition and semiconductor device
App 20040014843 - Sumita, Kazuaki ; et al. | 2004-01-22 |
Conductive resin compositions and electronic parts using the same
Grant 6,680,007 - Honda , et al. January 20, 2 | 2004-01-20 |
Heat resistant resin composition and adhesive film
App 20030220455 - Ichiroku, Nobuhiro ; et al. | 2003-11-27 |
Conductive resin composition
App 20030216505 - Akiba, Hideki ; et al. | 2003-11-20 |
Film-type adhesive for electronic components, and electronic components bonded therewith
Grant 6,645,632 - Honda , et al. November 11, 2 | 2003-11-11 |
Radiation curing silicone rubber composition and adhesive silicone elastomer film
App 20030190484 - Kashiwagi, Tsutomu ; et al. | 2003-10-09 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 6,630,745 - Osada , et al. October 7, 2 | 2003-10-07 |
Light-transmissive epoxy resin composition and semiconductor device
Grant 6,627,328 - Kanamaru , et al. September 30, 2 | 2003-09-30 |
Heat resistant resin composition and adhesive film
App 20030158350 - Ichiroku, Nobuhiro ; et al. | 2003-08-21 |
Liquid epoxy resin composition and semiconductor device
App 20030155664 - Sumita, Kazuaki ; et al. | 2003-08-21 |
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
App 20030152777 - Osada, Shoichi ; et al. | 2003-08-14 |
Optical waveguide forming material and method
App 20030148226 - Kodama, Kinya ; et al. | 2003-08-07 |
Flip-chip type semiconductor device
App 20030144382 - Honda, Tsuyoshi ; et al. | 2003-07-31 |
Conductive resin compositions and electronic parts using the same
App 20030078322 - Honda, Tsuyoshi ; et al. | 2003-04-24 |
Liquid epoxy resin composition and semiconductor device
App 20030069349 - Sumita, Kazuaki ; et al. | 2003-04-10 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
App 20030050399 - Kimura, Yasuo ; et al. | 2003-03-13 |
Epoxy resin composition, laminate film using the same, and semiconductor device
Grant 6,512,031 - Honda , et al. January 28, 2 | 2003-01-28 |
Optical device-related adhesive and optical device
App 20030010962 - Kuwabara, Haruyoshi ; et al. | 2003-01-16 |
Epoxy resin composition
Grant 6,506,822 - Ichiroku , et al. January 14, 2 | 2003-01-14 |
Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith
App 20020192477 - Honda, Tsuyoshi ; et al. | 2002-12-19 |
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
App 20020102429 - Asano, Eiichi ; et al. | 2002-08-01 |
Liquid epoxy resin composition and semiconductor device
App 20020089071 - Sumita, Kazuaki ; et al. | 2002-07-11 |
Epoxy resin compositions and premolded semiconductor packages
App 20020076558 - Tomiyoshi, Kazutoshi ; et al. | 2002-06-20 |
Liquid epoxy resin composition and semiconductor device
App 20020077421 - Sumita, Kazuaki ; et al. | 2002-06-20 |
Light-transmissive epoxy resin composition and flip-chip type semiconductor device
App 20020058742 - Honda, Tsuyoshi ; et al. | 2002-05-16 |
Light-transmissive epoxy resin composition and semiconductor device
App 20020058145 - Kanamaru, Tatsuya ; et al. | 2002-05-16 |
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
Grant 6,376,923 - Sumita , et al. April 23, 2 | 2002-04-23 |
Liquid epoxy resin composition and semiconductor device
App 20020045709 - Sumita, Kazuaki ; et al. | 2002-04-18 |
Epoxy resin composition
App 20020022681 - Ichiroku, Nobuhiro ; et al. | 2002-02-21 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
App 20020016398 - Osada, Shoichi ; et al. | 2002-02-07 |
Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith
App 20010034382 - Sumita, Kazuaki ; et al. | 2001-10-25 |
Film-type adhesive for electronic components, and electronic components bonded therewith
App 20010031828 - Honda, Tsuyoshi ; et al. | 2001-10-18 |
Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
Grant 6,294,271 - Sumita , et al. September 25, 2 | 2001-09-25 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 6,291,556 - Osada , et al. September 18, 2 | 2001-09-18 |
Epoxy resin compositions and premolded semiconductor packages
App 20010004651 - Tomiyoshi, Kazutoshi ; et al. | 2001-06-21 |
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices
Grant 6,231,997 - Arai , et al. May 15, 2 | 2001-05-15 |
Flip-chip type semiconductor device
Grant 6,225,704 - Sumita , et al. May 1, 2 | 2001-05-01 |
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
Grant 6,221,509 - Hirano , et al. April 24, 2 | 2001-04-24 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 6,168,872 - Ohashi , et al. January 2, 2 | 2001-01-02 |
Semiconductor encapsulating epoxy resin composition and semiconductor device
Grant 6,162,878 - Osada , et al. December 19, 2 | 2000-12-19 |
Method of fabricating a flip chip mold injected package
Grant 6,083,774 - Shiobara , et al. July 4, 2 | 2000-07-04 |
Encapsulant of crystalline epoxy resin and phenolic resin-crystalline epoxy resin reaction product
Grant 6,027,812 - Shiobara , et al. February 22, 2 | 2000-02-22 |
Epoxy resin composition
Grant 6,001,901 - Shiobara , et al. December 14, 1 | 1999-12-14 |
Epoxy resin compositions and semiconductor devices encapsulated therewith
Grant 5,994,785 - Higuchi , et al. November 30, 1 | 1999-11-30 |
Organic silicon compounds
Grant 5,336,786 - Shiobara , et al. August 9, 1 | 1994-08-09 |
Naphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resin
Grant 5,312,878 - Shiobara , et al. May 17, 1 | 1994-05-17 |
Thermosetting resin compositions
Grant 5,300,588 - Shiobara , et al. April 5, 1 | 1994-04-05 |
Semiconductor encapsulating epoxy resin compositions and semiconductor devices
Grant 5,250,637 - Shiobara , et al. October 5, 1 | 1993-10-05 |
Flip chip encapsulating compositions and semiconductor devices encapsulated therewith
Grant 5,248,710 - Shiobara , et al. September 28, 1 | 1993-09-28 |
Epoxy resin compositions and cured products thereof
Grant 5,225,484 - Shiobara , et al. July 6, 1 | 1993-07-06 |
Light transmissive epoxy resin compositions and optical semiconductor devices encapsulated therewith
Grant 5,198,479 - Shiobara , et al. March 30, 1 | 1993-03-30 |
High transparency silica-titania glass beads, method for making, and light transmission epoxy resin compositions
Grant 5,175,199 - Asano , et al. December 29, 1 | 1992-12-29 |
Epoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewith
Grant 5,166,228 - Shiobara , et al. November 24, 1 | 1992-11-24 |
Semiconductor encapsulating epoxy resin compositions
Grant 5,137,940 - Tomiyoshi , et al. August 11, 1 | 1992-08-11 |
Epoxy resin composition
Grant 5,053,445 - Itoh , et al. October 1, 1 | 1991-10-01 |
Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer
Grant 5,006,614 - Itoh , et al. April 9, 1 | 1991-04-09 |
Resin-encapsulated semiconductor devices
Grant 4,985,751 - Shiobara , et al. January 15, 1 | 1991-01-15 |
Epoxy resin-based curable compositions
Grant 4,902,732 - Itoh , et al. February 20, 1 | 1990-02-20 |
Epoxy resin composition
Grant 4,877,822 - Itoh , et al. October 31, 1 | 1989-10-31 |
Heat-curable silicone resin compositions
Grant 3,974,122 - Sato , et al. August 10, 1 | 1976-08-10 |
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