Shinyama; Keiji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shinyama; Keiji.The latest application filed is for "plating apparatus and plating method".
- Shinyama; Keiji - Kariya JP
- Shinyama; Keiji - Kariya-city JP
- Shinyama; Keiji - Okazaki-city JP
- Shinyama; Keiji - Okazaki JP
| Patent | Date |
|---|---|
| Plating apparatus and plating method Grant 8,932,440 - Shinyama , et al. January 13, 2 | 2015-01-13 |
| Plating apparatus and plating method App 20120073979 - Shinyama; Keiji ; et al. | 2012-03-29 |
| Semiconductor device having aluminum electrode and metallic electrode App 20060081996 - Shinyama; Keiji ; et al. | 2006-04-20 |
| Semiconductor device having aluminum and metal electrodes and method for manufacturing the same Grant 7,030,496 - Shinyama , et al. April 18, 2 | 2006-04-18 |
| Semiconductor sensor and method of plating semiconductor devices App 20050034526 - Shinyama, Keiji ; et al. | 2005-02-17 |
| Semiconductor device having aluminum and metal electrodes and method for manufacturing the same App 20050006778 - Shinyama, Keiji ; et al. | 2005-01-13 |
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