Shinwa Corp. Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shinwa Corp. Ltd..The latest application filed is for "system in-package test inspection apparatus and test inspection method".
- Shinwa Corp. Ltd. - Kanagawa JP
| Patent | Date |
|---|---|
| System in-package test inspection apparatus and test inspection method Grant 7,414,422 - Aoyagi , et al. August 19, 2 | 2008-08-19 |
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