Shintani; Toshio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shintani; Toshio.The latest application filed is for "adhesive tape or sheet".

Company Profile

0.6.33

Shintani; Toshio - Ibaraki-shi JP
Shintani; Toshio - Ibaraki N/A JP
Shintani; Toshio - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive Tape Or Sheet App 20140154450 - Yutou; Takumi ; et al.	2014-06-05
Laminate App 20130251985 - Nakanishi; Tadatoshi ; et al.	2013-09-26
Substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, method for grinding back side of semiconductor wafer using pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive sheet Grant 8,388,786 - Habu , et al. March 5, 2	2013-03-05
Tackiness Adhesive Sheet For Thin-film Substrate Fixing App 20120222805 - SHINTANI; Toshio ; et al.	2012-09-06
Method For Manufacturing Thin-film Substrate App 20120223455 - SHINTANI; Toshio ; et al.	2012-09-06
Laminate For Nonaqueous Battery App 20120196171 - IKISHIMA; Shinsuke ; et al.	2012-08-02
Adhesive Sheet For Processing Of Semiconductor Wafter App 20120114938 - Ooishi; Michihito ; et al.	2012-05-10
Pressure-sensitive Adhesive Tape For Battery App 20120107573 - Iwata; Jun ; et al.	2012-05-03
Method Of Semiconductor Wafer Back Processing, Method Of Substrate Back Processing, And Radiation-curable Pressure-sensitive Adhesive Sheet App 20110300709 - Shintani; Toshio	2011-12-08
Adhesive Tape Or Sheet App 20110151252 - Shintani; Toshio ; et al.	2011-06-23
Adhesive sheet for processing semiconductor substrates Grant 7,943,235 - Yamamoto , et al. May 17, 2	2011-05-17
Re-peelable Adhesive Sheet App 20110097576 - HABU; Takashi ; et al.	2011-04-28
Substrate-less Pressure-sensitive Adhesive Sheet For Protection Of Semiconductor Wafer, Method For Grinding Back Side Of Semiconductor Wafer Using Pressure-sensitive Adhesive Sheet, And Method For Producing Pressure-sensitive Adhesive Sheet App 20100230036 - HABU; Takashi ; et al.	2010-09-16
Pressure-sensitive adhesive sheet for processing semiconductor wafer or semiconductor substrate Grant 7,727,811 - Shintani , et al. June 1, 2	2010-06-01
Adhesive Sheet For Processing Semiconductor Substrates App 20100028662 - Shintani; Toshio ; et al.	2010-02-04
Method Of Grinding Back Side Of Semiconductor Wafer And Adhesive Sheet For Use In The Method Of Grinding Back Side Of Semiconductor Wafer App 20090314417 - SASAKI; Takatoshi ; et al.	2009-12-24
Adhesive Sheet For Water Jet Laser Dicing App 20090311474 - Takahashi; Tomokazu ; et al.	2009-12-17
Adhesive Sheet For Processing Semiconductor Substrates App 20080261038 - Yamamoto; Akiyoshi ; et al.	2008-10-23
Pressure-sensitive Adhesive Sheet For Processing App 20080248296 - SHINTANI; Toshio ; et al.	2008-10-09
Adhesive Sheet For Water Jet Laser Dicing App 20080182095 - Asai; Fumiteru ; et al.	2008-07-31
Removable Pressure-sensitive Adhesive Composition And Pressure-sensitive Adhesive Tape Or Sheet App 20080138618 - Sasaki; Takatoshi ; et al.	2008-06-12
Adhesive Sheet For Processing Semiconductor Wafers And/or Substrates App 20080118764 - SHINTANI; Toshio ; et al.	2008-05-22
Adhesive Sheet For Water Jet Laser Dicing App 20080108262 - Asai; Fumiteru ; et al.	2008-05-08
Adhesive sheet for laser processing App 20080085397 - Asai; Fumiteru ; et al.	2008-04-10
Method Of Semiconductor Wafer Back Processing, Method Of Substrate Back Processing, And Radiation-curable Pressure-sensitive Adhesive Sheet App 20080057216 - SHINTANI; Toshio	2008-03-06
Adhesive sheet for laser processing App 20080057306 - Sasaki; Takatoshi ; et al.	2008-03-06
Adhesive sheet for water jet laser dicing App 20080057270 - Miki; Tsubasa ; et al.	2008-03-06
Adhesive sheet for water jet laser dicing App 20080057253 - Sasaki; Takatoshi ; et al.	2008-03-06
Warpage-inhibitive Pressure-sensitive Adhesive Sheets For Wafer Grinding App 20080038551 - SHINTANI; Toshio	2008-02-14
Pressure-sensitive Adhesive Sheet For Processing Semiconductor Wafer Or Semiconductor Substrate App 20070264498 - Shintani; Toshio ; et al.	2007-11-15
Pressure-sensitive adhesive tape or sheet for application to active surface in dicing and method of picking up chips of work App 20070190318 - Asai; Fumiteru ; et al.	2007-08-16
Pressure-sensitive adhesive sheet, production method thereof and method of processing articles App 20070036930 - Kontani; Tomohiro ; et al.	2007-02-15
Wired circuit board Grant 6,841,737 - Komatsubara , et al. January 11, 2	2005-01-11
Circuit board and connection structure of terminal portion of the same Grant 6,717,059 - Shintani , et al. April 6, 2	2004-04-06
Wired circuit board App 20030026078 - Komatsubara, Makoto ; et al.	2003-02-06
Circuit board and connection structure of terminal portion of the same App 20020066594 - Shintani, Toshio ; et al.	2002-06-06

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