Shinryo Corporation

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shinryo Corporation.The latest application filed is for "washing method of semiconductor manufacturing device component having gas holes".

Company Profile

7.9.9

Shinryo Corporation - Kita Kyushu N/A JP
Shinryo Corporation - Kita Kyushu-shi JP
Shinryo Corporation - Kyushu N/A JP
Shinryo Corporation - Tokyo JP
Shinryo Corporation - Shinjuku-ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of producing reclaimed carbon fiber bundles, reclaimed carbon fibers, or reclaimed milled carbon fibers, device for producing reclaimed carbon fiber bundles, method of producing carbon fiber reinforced resin, and reclaimed carbon fiber bundles Grant 11,359,060 - Toyoshima , et al. June 14, 2	2022-06-14
Washing Method Of Semiconductor Manufacturing Device Component Having Gas Holes App 20220136101 - MATSUMURA; Tomohiro ; et al.	2022-05-05
Gas-containing base material and manufacturing method therefor Grant 10,905,635 - Takeda , et al. February 2, 2	2021-02-02
Method Of Producing Reclaimed Carbon Fiber Bundles, Reclaimed Carbon Fibers, Or Reclaimed Milled Carbon Fibers, Device For Produ App 20200079918 - TOYOSHIMA; Hirokazu ; et al.	2020-03-12
Method For Producing Hydrogen Gas-containing Material And Device For Producing Hydrogen Gas-containing Material App 20190335795 - TOYONAGA; Ken ; et al.	2019-11-07
Gas-containing Base Material And Manufacturing Method Therefor App 20190029927 - TAKEDA; Tooru ; et al.	2019-01-31
Antigen supply device Grant 8,262,988 - Tang , et al. September 11, 2	2012-09-11
Antigen exposure chamber system Grant 8,029,729 - Tang , et al. October 4, 2	2011-10-04
Antigen exposure chamber and method of cleaning and drying the same Grant 7,819,987 - Fujita , et al. October 26, 2	2010-10-26
Antigen Exposure Chamber System App 20090257919 - Tang; Huaipeng ; et al.	2009-10-15
Method and apparatus for subjecting gases to discharge treatment Grant 4,780,277 - Tanaka , et al. October 25, 1	1988-10-25
Chemical heat pump utilizing clathrate formation reaction Grant 4,718,242 - Yamauchi , et al. January 12, 1	1988-01-12

Company Registrations

NCAGE Code	SKZ22	SHINRYO CORPORATION
CAGE Code	SKZ22	SHINRYO CORPORATION

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