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Patent applications and USPTO patent grants for Shinozaki; Dai.The latest application filed is for "semiconductor device and heat-dissipating mechanism".
Patent | Date |
---|---|
Semiconductor device and heat-dissipating mechanism Grant 9,607,922 - Matsuda , et al. March 28, 2 | 2017-03-28 |
Semiconductor Device And Heat-dissipating Mechanism App 20160049350 - MATSUDA; Kenji ;   et al. | 2016-02-18 |
Method For Forming Sintered Silver Coating Film, Baking Apparatus, And Semiconductor Device App 20140239484 - MATSUDA; Kenji ;   et al. | 2014-08-28 |
Mounting method and mounting device Grant 8,749,068 - Nakamura , et al. June 10, 2 | 2014-06-10 |
Method for evaluating semiconductor device Grant 8,471,585 - Miyazono , et al. June 25, 2 | 2013-06-25 |
Mounting Method And Mounting Device App 20120291950 - Sugiyama; Masahiko ;   et al. | 2012-11-22 |
Mounting Method And Mounting Device App 20120292775 - Nakamura; Michikazu ;   et al. | 2012-11-22 |
Method for evaluating semiconductor device App 20110050269 - Miyazono; Mitsuyoshi ;   et al. | 2011-03-03 |
Circuit for protecting DUT, method for protecting DUT, testing apparatus and testing method Grant 7,701,241 - Kumagai , et al. April 20, 2 | 2010-04-20 |
Inspection apparatus, probe card and inspection method Grant 7,586,317 - Komatsu , et al. September 8, 2 | 2009-09-08 |
Inspection Apparatus, Probe Card And Inspection Method App 20090021272 - Komatsu; Shigekazu ;   et al. | 2009-01-22 |
Inspection method and inspection equipment Grant 7,301,357 - Shinozaki , et al. November 27, 2 | 2007-11-27 |
Circuit For Protecting Dut, Method For Protecting Dut, Testing Apparatus And Testing Method App 20070223156 - Kumagai; Yasunori ;   et al. | 2007-09-27 |
Inspection method and inspection equipment App 20060061374 - Shinozaki; Dai ;   et al. | 2006-03-23 |
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