SHINODA; Toshio

Patent Applications and Registrations

Patent applications and USPTO patent grants for SHINODA; Toshio.The latest application filed is for "polishing composition and polishing method".

Company Profile

6.5.12

SHINODA; Toshio - Kiyosu-shi JP
Shinoda; Toshio - Aichi JP
Shinoda; Toshio - Aich JP
Shinoda; Toshio - Kiyosu JP
SHINODA; Toshio - Kakamigahara-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing Composition And Polishing Method App 20220275246 - ITO; Daiki ; et al.	2022-09-01
Polishing Composition, Method For Manufacturing Polishing Composition, And Polishing Method App 20220220339 - ITO; Daiki ; et al.	2022-07-14
Polishing composition and method for manufacturing same, polishing method, and method for manufacturing substrate Grant 10,988,636 - Shinoda , et al. April 27, 2	2021-04-27
Polishing Composition App 20200308450 - SHINODA; Toshio ; et al.	2020-10-01
Polishing Composition And Polishing System App 20200071567 - Shinoda; Toshio ; et al.	2020-03-05
Polishing Composition And Method For Manufacturing Same, Polishing Method, And Method For Manufacturing Substrate App 20200048497 - Shinoda; Toshio ; et al.	2020-02-13
Polishing composition and polishing method using the same Grant 10,406,652 - Shinoda Sept	2019-09-10
Polishing Composition, Method For Producing Same, Polishing Method, And Method For Producing Substrate App 20190085208 - SHINODA; Toshio ; et al.	2019-03-21
Polishing Composition And Polishing Method Using Same, And Method For Producing Polishing-completed Object To Be Polished Using Same App 20190077991 - SHINODA; Toshio ; et al.	2019-03-14
Polishing Composition And Polishing Method Using The Same App 20170136600 - SHINODA; Toshio	2017-05-18
Polishing composition to be used to polish semiconductor substrate having silicon through electrode structure, and polishing method using polishing composition Grant 9,340,707 - Shinoda May 17, 2	2016-05-17
Composition for polishing and method of polishing semiconductor substrate using same Grant 9,090,799 - Shinoda , et al. July 28, 2	2015-07-28
Polishing Composition To Be Used To Polish Semiconductor Substrate Having Silicon Through Electrode Structure, And Polishing Method Using Polishing Composition App 20150111382 - Shinoda; Toshio	2015-04-23
Composition For Polishing And Method Of Polishing Semiconductor Substrate Using Same App 20130260650 - Shinoda; Toshio ; et al.	2013-10-03
Method Of Polishing Wafer Surface On Which Copper And Silicon Are Exposed App 20110250755 - MORINAGA; Hitoshi ; et al.	2011-10-13

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