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Patent applications and USPTO patent grants for Shinoda; Hirofumi.The latest application filed is for "composite type semiconductor device spacer sheet, semiconductor package using the same, composite type semiconductor device manufacturing method, and composite type semiconductor device".
Patent | Date |
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Composite Type Semiconductor Device Spacer Sheet, Semiconductor Package Using The Same, Composite Type Semiconductor Device Manufacturing Method, And Composite Type Semiconductor Device App 20100090323 - Shinoda; Tomonori ;   et al. | 2010-04-15 |
Composite Semiconductor Device, Semiconductor Package And Spacer Sheet Used In The Same, And Method For Manufacturing Composite Semiconductor Device App 20100025837 - Shinoda; Tomonori ;   et al. | 2010-02-04 |
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