SHINKAI; Hideki
Patent Applications and Registrations
Patent applications and USPTO patent grants for SHINKAI; Hideki.The latest application filed is for "electronic component module".
- SHINKAI; Hideki - Nagaokakyo-shi JP
- SHINKAI; Hideki - Kyoto JP
- Shinkai; Hideki - Nagaokakyo JP
- Shinkai; Hideki - Kanazawa JP
- Shinkai; Hideki - Ishikawa-ken JP
- Shinkai, Hideki - Kanazawa-shi JP
| Patent | Date |
|---|---|
| Electronic Component Module App 20220102255 - SHINKAI; Hideki ; et al. | 2022-03-31 |
| Electronic Component Module And Manufacturing Method Of Electronic Component Module App 20210243887 - SHINKAI; Hideki | 2021-08-05 |
| Circuit module Grant 11,076,484 - Nomura , et al. July 27, 2 | 2021-07-27 |
| Module App 20210225779 - OTSUBO; Yoshihito ; et al. | 2021-07-22 |
| Vacuum device Grant 10,861,683 - Yamamoto , et al. December 8, 2 | 2020-12-08 |
| Circuit Module App 20200258797 - A1 | 2020-08-13 |
| Circuit Module App 20200260581 - A1 | 2020-08-13 |
| Vacuum Device App 20170250061 - YAMAMOTO; Issei ; et al. | 2017-08-31 |
| Manufacturing method of electronic component Grant 7,752,747 - Higuchi , et al. July 13, 2 | 2010-07-13 |
| Manufacturing Method of Electronic Component App 20080313895 - Higuchi; Masato ; et al. | 2008-12-25 |
| Method of producing piezoelectric component and piezoelectric component Grant 7,261,792 - Higuchi , et al. August 28, 2 | 2007-08-28 |
| Method of producing piezoelectric component and piezoelectric component App 20040169444 - Higuchi, Masato ; et al. | 2004-09-02 |
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