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Patent applications and USPTO patent grants for Shinbara; Kaoru.The latest application filed is for "method of and apparatus for processing substrate".
Patent | Date |
---|---|
Method of and apparatus for processing substrate Grant 6,273,104 - Shinbara , et al. August 14, 2 | 2001-08-14 |
Substrate processing unit and substrate processing apparatus using the same Grant 6,155,275 - Shinbara December 5, 2 | 2000-12-05 |
Substrate treating apparatus Grant 5,485,644 - Shinbara , et al. January 23, 1 | 1996-01-23 |
Wafer cleaning method and apparatus therefore Grant 5,288,333 - Tanaka , et al. February 22, 1 | 1994-02-22 |
Wafer cleaning method and apparatus therefor Grant 5,158,100 - Tanaka , et al. October 27, 1 | 1992-10-27 |
Wafer holding mechanism Grant 4,788,994 - Shinbara December 6, 1 | 1988-12-06 |
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