Shinba; Yoichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shinba; Yoichi.The latest application filed is for "adhesive composition sheet, method of producing same, and semiconductor device".

Company Profile

0.5.8

Shinba; Yoichi - Otsu JP
SHINBA; Yoichi - Otsu-shi Shiga
Shinba; Yoichi - Shiga JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive composition sheet, method of producing same, and semiconductor device Grant 10,563,095 - Shinba Feb	2020-02-18
Adhesive Composition Sheet, Method Of Producing Same, And Semiconductor Device App 20180016470 - SHINBA; Yoichi	2018-01-18
Adhesive Composition, Adhesive Sheet, And Semiconductor Device Using The Adhesive Composition Or The Adhesive Sheet App 20130245160 - Shimada; Akira ; et al.	2013-09-19
Process For Production Of Core-shell Particles, Core-shell Particles, And Paste Composition And Sheet Composition Which Contain Same App 20120183775 - Shinba; Yoichi ; et al.	2012-07-19
Paste composition for light guide and light guide utilizing the same Grant 7,960,462 - Shinba , et al. June 14, 2	2011-06-14
Paste Composition For Light Guide And Light Guide Utilizing The Same App 20090270541 - Shinba; Yoichi ; et al.	2009-10-29
Laminated member for circuit board, method and apparatus for manufacturing of circuit board Grant 7,540,079 - Okuyama , et al. June 2, 2	2009-06-02
Methods for making laminated member for circuit board, making circuit board and laminating flexible film Grant 7,534,361 - Akamatsu , et al. May 19, 2	2009-05-19
Methods for making laminated member for circuit board, making circuit board and laminating flexible film App 20060237133 - Akamatsu; Takayoshi ; et al.	2006-10-26
Circuit board, laminated member for circuit board, and method for making laminated member for circuit board Grant 7,105,221 - Akamatsu , et al. September 12, 2	2006-09-12
Member for circuit board, method and manufacturing circuit board, apparatus for manufacturing circuit board App 20060131260 - Okuyama; Futoshi ; et al.	2006-06-22
Circuit board, circuit board-use member and production method therefor and method of laminating fexible film App 20040026363 - Akamatsu, Takayoshi ; et al.	2004-02-12

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