Shinagawa; Hirofumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shinagawa; Hirofumi.The latest application filed is for "resin substrate, component-mounting resin substrate, and method of manufacturing component-mounting resin substrate".

Company Profile

4.12.12

Shinagawa; Hirofumi - Nagaokakyo JP
SHINAGAWA; Hirofumi - Nagaokakyo-shi JP
Shinagawa; Hirofumi - Kyoto JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin substrate, component-mounting resin substrate, and method of manufacturing component-mounting resin substrate Grant 10,741,462 - Yosui , et al. A	2020-08-11
Component-embedded substrate and substrate flaw detecting method Grant 10,338,031 - Tago , et al.	2019-07-02
Component built-in substrate Grant 10,231,342 - Tago , et al.	2019-03-12
Multilayer resin substrate, and method of manufacturing multilayer resin substrate Grant 10,219,367 - Shinagawa , et al. Feb	2019-02-26
Resin Substrate, Component-mounting Resin Substrate, And Method Of Manufacturing Component-mounting Resin Substrate App 20180182681 - YOSUI; Kuniaki ; et al.	2018-06-28
Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same Grant 9,986,139 - Tago , et al. May 29, 2	2018-05-29
Component-embedded substrate Grant 9,974,185 - Tago , et al. May 15, 2	2018-05-15
Method for manufacturing resin multilayer board Grant 9,961,780 - Shinagawa , et al. May 1, 2	2018-05-01
Substrate for stacked module, stacked module, and method for manufacturing stacked module Grant 9,922,918 - Tago , et al. March 20, 2	2018-03-20
Multilayer Resin Substrate, And Method Of Manufacturing Multilayer Resin Substrate App 20180070435 - SHINAGAWA; Hirofumi ; et al.	2018-03-08
Camera Module Including Multilayer Base Body, Image Sensor Ic, Lens Unit, Peripheral Circuit Components, And Connector Element And Electronic Device Including Same App 20180027154 - TAGO; Shigeru ; et al.	2018-01-25
Module component Grant 9,854,677 - Tago , et al. December 26, 2	2017-12-26
Multilayer resin substrate, and method of manufacturing multilayer resin substrate Grant 9,848,489 - Shinagawa , et al. December 19, 2	2017-12-19
Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same Grant 9,813,595 - Tago , et al. November 7, 2	2017-11-07
Component Built-in Substrate And Method For Manufacturing Component Built-in Substrate App 20170223837 - TAGO; Shigeru ; et al.	2017-08-03
Substrate For Stacked Module, Stacked Module, And Method For Manufacturing Stacked Module App 20170179014 - TAGO; Shigeru ; et al.	2017-06-22
Component-embedded Substrate And Substrate Flaw Detecting Method App 20170176392 - TAGO; Shigeru ; et al.	2017-06-22
Component-embedded substrate and communication module Grant 9,629,249 - Tago , et al. April 18, 2	2017-04-18
Module Component App 20160330843 - TAGO; Shigeru ; et al.	2016-11-10
Component-embedded Substrate App 20160157354 - TAGO; Shigeru ; et al.	2016-06-02
Component-embedded Substrate And Communication Module App 20160066428 - Tago; Shigeru ; et al.	2016-03-03
Method For Manufacturing Resin Multilayer Board App 20160050766 - Shinagawa; Hirofumi ; et al.	2016-02-18
Multilayer Resin Substrate, And Method Of Manufacturing Multilayer Resin Substrate App 20160037622 - SHINAGAWA; Hirofumi ; et al.	2016-02-04
Camera Module And Electronic Device App 20150373238 - TAGO; Shigeru ; et al.	2015-12-24

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