Shinada; Eiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shinada; Eiichi.The latest application filed is for "method for manufacturing multilayer wiring board".

Company Profile

6.11.7

Shinada; Eiichi - Tokyo JP
SHINADA; Eiichi - Chiyoda-ku Tokyo
Shinada; Eiichi - Tsukuba JP
Shinada; Eiichi - Tsukuba-shi JP
Shinada; Eiichi - Ibaraki JP
Shinada; Eiichi - Ibaraki-ken JP
Shinada; Eiichi - Shimodate JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing multilayer wiring board Grant 11,291,124 - Tanabe , et al. March 29, 2	2022-03-29
Method for manufacturing multilayer wiring board Grant 11,240,915 - Kato , et al. February 1, 2	2022-02-01
Method For Manufacturing Multilayer Wiring Board App 20190350083 - KATO; Masahiro ; et al.	2019-11-14
Method For Manufacturing Multilayer Wiring Board App 20190313536 - TANABE; Yuto ; et al.	2019-10-10
Adhesive agent, adhesive material using the same, and method of use thereof Grant 10,328,683 - Masuda , et al.	2019-06-25
Adhesive agent, adhesive material using the same, and method of use thereof Grant 10,322,572 - Masuda , et al.	2019-06-18
Adhesive Agent, Adhesive Material Using The Same, And Method Of Use Thereof App 20130020021 - MASUDA; Katsuyuki ; et al.	2013-01-24
Adhesive Agent, Adhesive Material Using The Same, And Method Of Use Thereof App 20130008592 - MASUDA; Katsuyuki ; et al.	2013-01-10
Adhesive Agent, Adhesive Material Using The Same, And Method Of Use Thereof App 20130008593 - MASUDA; Katsuyuki ; et al.	2013-01-10
Method for manufacturing multilayer wiring board Grant 7,870,663 - Shinada , et al. January 18, 2	2011-01-18
Method for Manufacturing Multilayer Wiring Board App 20090007425 - Shinada; Eiichi ; et al.	2009-01-08
Circuit boards using heat resistant resin for adhesive layers Grant 6,121,553 - Shinada , et al. September 19, 2	2000-09-19
Multiple wire printed circuit board and process for making the same Grant 6,042,685 - Shinada , et al. March 28, 2	2000-03-28
Multiple wire adhesive on a multiple wire wiring board Grant 5,486,655 - Arike , et al. January 23, 1	1996-01-23
Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator Grant 5,403,869 - Arike , et al. April 4, 1	1995-04-04

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