Shin; Young Hwan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shin; Young Hwan.The latest application filed is for "dual blade blower".

Company Profile

3.36.37

Shin; Young Hwan - Daejeon KR
Shin; Young Hwan - Seongnam-si KR
SHIN; Young Hwan - Uijeongbu-si Gyeonggi-do KR
SHIN; Young-Hwan - YONGIN-SI KR
Shin; Young-Hwan - Gyunggi-do KR
Shin; Young-Hwan - Yuseong-gu KR
Shin; Young Hwan - Daejeon-si KR
Shin; Young-Hwan - Yoosung-gu KR
Shin; Young Hwan - Taejeon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sublimation purification apparatus and sublimation purification method Grant 11,426,678 - Hong , et al. August 30, 2	2022-08-30
Rear combination lamp for an automobile Grant D952,213 - Shin , et al. May 17, 2	2022-05-17
Head lamp for an automobile Grant D952,210 - Shin , et al. May 17, 2	2022-05-17
Rear combination lamp for an automobile Grant D952,212 - Shin May 17, 2	2022-05-17
Head lamp for an automobile Grant D951,503 - Shin , et al. May 10, 2	2022-05-10
Rear combination lamp for an automobile Grant D950,816 - Kuehn , et al. May 3, 2	2022-05-03
Rear combination lamp for an automobile Grant D950,817 - Kuehn , et al. May 3, 2	2022-05-03
Dual Blade Blower App 20220128063 - SHIN; Young Hwan	2022-04-28
Sublimation Purification Apparatus And Sublimation Purification Method App 20200406163 - HONG; Seok Kwang ; et al.	2020-12-31
Light Emitting Diode Module App 20170179084 - KIM; Dae-Won ; et al.	2017-06-22
Printed circuit board and method for manufacturing the same Grant 9,526,169 - Ha , et al. December 20, 2	2016-12-20
Printed Circuit Board And Method For Manufacturing The Same App 20150382461 - HA; Hyung Gi ; et al.	2015-12-31
Printed circuit board and method for manufacturing the same Grant 9,161,460 - Ha , et al. October 13, 2	2015-10-13
Method of manufacturing flip chip package Grant 8,809,122 - Kim , et al. August 19, 2	2014-08-19
Method Of Manufacturing Flip Chip Package App 20140030855 - KIM; Ey Yong ; et al.	2014-01-30
Flip chip package and method of manufacturing the same Grant 8,558,360 - Kim , et al. October 15, 2	2013-10-15
Method of manufacturing printed circuit board Grant 8,399,801 - Oh , et al. March 19, 2	2013-03-19
Board On Chip Package Substrate And Manufacturing Method Thereof App 20120244662 - KIM; Ji-Eun ; et al.	2012-09-27
Printed circuit board and semiconductor package with the same Grant 8,253,034 - Kim , et al. August 28, 2	2012-08-28
Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad Grant 8,236,690 - Yoon , et al. August 7, 2	2012-08-07
Printed Circuit Board And Method For Manufacturing The Same App 20120168212 - HA; Hyung Gi ; et al.	2012-07-05
Method of manufacturing electronic component embedded circuit board Grant 8,201,324 - Kim , et al. June 19, 2	2012-06-19
Method Of Manufacturing Electronic Component Embedded Circuit Board App 20120134125 - Kim; Byoung-Chan ; et al.	2012-05-31
Manufacturing method of printed circuit board and manufacturing apparatus for the same Grant 8,144,972 - Cho , et al. March 27, 2	2012-03-27
Printed circuit board and method of manufacturing the same App 20120043128 - Yoon; Kyoung Ro ; et al.	2012-02-23
Printed circuit board for package and manufacturing method thereof Grant 8,106,308 - Jeon , et al. January 31, 2	2012-01-31
Printed circuit board and manufacturing method thereof Grant 8,084,696 - Kim , et al. December 27, 2	2011-12-27
Printed circuit board and semiconductor package with the same App 20110286191 - Kim; Byoung Chan ; et al.	2011-11-24
Substrate For A Semiconductor Package And Manufacturing Method Thereof App 20110266671 - Youm; Kwang Seop ; et al.	2011-11-03
Board On Chip Package Substrate And Manufacturing Method Thereof App 20110110058 - KIM; Ji-Eun ; et al.	2011-05-12
Board On Chip Package Substrate And Manufacturing Method Thereof App 20110101510 - YOON; Kyung-Ro ; et al.	2011-05-05
Flip chip package and method of manufacturing the same App 20110095421 - Kim; Ey Yong ; et al.	2011-04-28
Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad App 20100261348 - Yoon; Kyoung Ro ; et al.	2010-10-14
Method Of Manufacturing Printed Circuit Board App 20100258545 - OH; Hwa-Sub ; et al.	2010-10-14
Method of manufacturing copper-clad laminate for VOP application Grant 7,807,215 - Lee , et al. October 5, 2	2010-10-05
Method for manufacturing the BGA package board Grant 7,802,361 - Yoon , et al. September 28, 2	2010-09-28
Electro component package Grant 7,795,719 - Kim , et al. September 14, 2	2010-09-14
Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same Grant 7,768,116 - Yoon , et al. August 3, 2	2010-08-03
Printed Circuit Board And Manufacturing Method Thereof App 20100147575 - Lee; Han-Ul ; et al.	2010-06-17
Printed Circuit Board And Manufacturing Method Thereof App 20100122842 - KIM; Tae-Gui ; et al.	2010-05-20
Electro Component Package App 20100090351 - Kim; Heung-Kyu ; et al.	2010-04-15
Manufacturing method of printed circuit board and manufacturing apparatus for the same App 20100021045 - Cho; Chung Woo ; et al.	2010-01-28
Method Of Manufacturing Electronic Component Embedded Circuit Board App 20100012364 - KIM; Byoung-Chan ; et al.	2010-01-21
Via hole having fine hole land and method for forming the same Grant 7,629,692 - Kim , et al. December 8, 2	2009-12-08
Bga Package Substrate And Method Of Fabricating Same App 20080223610 - Choi; Jae Min ; et al.	2008-09-18
Method For Manufacturing The Bga Package Board App 20080216314 - Yoon; Kyoung-Ro ; et al.	2008-09-11
Method for forming via hole having fine hole land App 20080209722 - Kim; Chong Ho ; et al.	2008-09-04
BGA package board and method for manufacturing the same Grant 7,408,261 - Yoon , et al. August 5, 2	2008-08-05
BGA package substrate and method of fabricating same Grant 7,387,917 - Choi , et al. June 17, 2	2008-06-17
Method of manufacturing copper-clad laminate for VOP application App 20080073025 - Lee; Jong Jin ; et al.	2008-03-27
Method of fabricating printed circuit board having thin core layer Grant 7,346,982 - Kim , et al. March 25, 2	2008-03-25
Printed circuit board for package and manufacturing method thereof App 20080066954 - Jeon; Hyung-Jin ; et al.	2008-03-20
System for and method of analyzing surface condition of PCB using RGB colors Grant 7,298,887 - Lee , et al. November 20, 2	2007-11-20
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same Grant 7,256,495 - Lee , et al. August 14, 2	2007-08-14
Via hole having fine hole land and method for forming the same App 20070132087 - Kim; Chong Ho ; et al.	2007-06-14
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same Grant 7,208,349 - Lee , et al. April 24, 2	2007-04-24
Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same App 20070069360 - Yoon; Kyoung Ro ; et al.	2007-03-29
Method of fabricating printed circuit board having thin core layer App 20060121256 - Kim; Chong Ho ; et al.	2006-06-08
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same Grant 7,030,500 - Shin , et al. April 18, 2	2006-04-18
BGA package board and method for manufacturing the same App 20060017151 - Yoon; Kyoung-Ro ; et al.	2006-01-26
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same App 20050194696 - Shin, Young-Hwan ; et al.	2005-09-08
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same App 20050095862 - Lee, Jong-Jin ; et al.	2005-05-05
BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same App 20050051895 - Kim, Byoung-Chan ; et al.	2005-03-10
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same Grant 6,852,625 - Shin , et al. February 8, 2	2005-02-08
System for and method of analyzing surface condition of PCB using RGB colors App 20040234119 - Lee, Hyo-Soo ; et al.	2004-11-25
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same App 20040173375 - Lee, Jong-Jin ; et al.	2004-09-09
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same App 20040113244 - Shin, Young-Hwan ; et al.	2004-06-17
Method for manufacturing build-up multi-layer printed circuit board by using yag laser Grant 6,405,431 - Shin , et al. June 18, 2	2002-06-18
Method for manufacturing build-up multi-layer printed circuit board Grant 5,837,427 - Hwang , et al. November 17, 1	1998-11-17

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