Shin; Yee Na

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shin; Yee Na.The latest application filed is for "printed circuit board including embedded electronic component and method for manufacturing the same".

Company Profile

1.15.29

Shin; Yee Na - Suwon-si KR
Shin; Yee Na - Suwon KR
Shin; Yee Na - Yeongi-gun KR
Shin; Yee Na - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing a printed circuit board including an embedded electronic component Grant 10,887,995 - Lee , et al. January 5, 2	2021-01-05
Printed Circuit Board Including Embedded Electronic Component And Method For Manufacturing The Same App 20180279478 - LEE; Seung Eun ; et al.	2018-09-27
Printed circuit board including embedded electronic component and method for manufacturing the same Grant 10,015,884 - Lee , et al. July 3, 2	2018-07-03
Circuit board and method of manufacturing the same Grant 9,788,433 - Lee , et al. October 10, 2	2017-10-10
Printed circuit board including electronic component embedded therein and method for manufacturing the same Grant 9,526,177 - Lee , et al. December 20, 2	2016-12-20
Printed circuit board having embedded electronic device and method of manufacturing the same Grant 9,504,169 - Hwang , et al. November 22, 2	2016-11-22
Multilayered substrate Grant 9,474,167 - Shin , et al. October 18, 2	2016-10-18
Electronic component embedded substrate and manufacturing method thereof Grant 9,462,697 - Chung , et al. October 4, 2	2016-10-04
Substrate embedding passive element Grant 9,420,683 - Lee , et al. August 16, 2	2016-08-16
Circuit Board And Method Of Manufacturing The Same App 20160205773 - LEE; Doo Hwan ; et al.	2016-07-14
Multilayer ceramic capacitor and printed circuit board including the same Grant 9,345,141 - Lee , et al. May 17, 2	2016-05-17
Substrate having electronic component embedded therein and method of manufacturing the same Grant 9,313,893 - Lee , et al. April 12, 2	2016-04-12
Multilayered substrate and method of manufacturing the same Grant 9,307,632 - Lee , et al. April 5, 2	2016-04-05
Method For Manufacturing Semiconductor Package App 20150380276 - SHIN; Yee Na ; et al.	2015-12-31
Method for manufacturing semiconductor package Grant 9,171,780 - Shin , et al. October 27, 2	2015-10-27
Passive device embedded in substrate and substrate with passive device embedded therein Grant 9,155,199 - Shin , et al. October 6, 2	2015-10-06
Multilayered Substrate And Method Of Manufacturing The Same App 20150195907 - CHUNG; Yul Kyo ; et al.	2015-07-09
Method For Manufacturing Semiconductor Package App 20150147849 - SHIN; Yee Na ; et al.	2015-05-28
Pcb Having Glass Core App 20150027757 - SHIN; Yee Na ; et al.	2015-01-29
Printed Circuit Board Having Embedded Electronic Device And Method Of Manufacturing The Same App 20150014034 - Hwang; Young Nam ; et al.	2015-01-15
Image Sensor Module And Method Of Manufacturing The Same App 20140374870 - Lee; Kyung Ho ; et al.	2014-12-25
Printed Circuit Board Including Electronic Component Embedded Therein And Method For Manufacturing The Same App 20140321084 - LEE; Seung Eun ; et al.	2014-10-30
Circuit Board And Method Of Manufacturing The Same App 20140182916 - SHIN; Yee Na ; et al.	2014-07-03
Multilayered Substrate App 20140182889 - SHIN; Yee Na ; et al.	2014-07-03
Circuit Board And Method Of Manufacturing The Same App 20140182897 - LEE; Doo Hwan ; et al.	2014-07-03
Printed Circuit Board Including Embedded Electronic Component And Method For Manufacturing The Same App 20140182911 - Lee; Seung Eun ; et al.	2014-07-03
Substrate Embedding Passive Element App 20140185258 - LEE; Doo Hwan ; et al.	2014-07-03
Substrate Having Electronic Component Embedded Therein And Method Of Manufacturing The Same App 20140182896 - LEE; Doo Hwan ; et al.	2014-07-03
Multilayered Substrate And Method Of Manufacturing The Same App 20140182895 - LEE; Doo Hwan ; et al.	2014-07-03
Core Substrate And Method For Manufacturing The Same, And Substrate With Built-in Electronic Components And Method For Manufacturing The Same App 20140177192 - Lee; Seung Eun ; et al.	2014-06-26
Electronic Component Embedded Substrate And Manufacturing Method Thereof App 20140151104 - CHUNG; Yul Kyo ; et al.	2014-06-05
Electronic Component Embedded Substrate And Manufacturing Method Thereof App 20140144676 - CHUNG; Yul Kyo ; et al.	2014-05-29
Multilayer Ceramic Capacitor And Printed Circuit Board Including The Same App 20140116761 - Lee; Seung Eun ; et al.	2014-05-01
Passive Device Embedded In Substrate And Substrate With Passive Device Embedded Therein App 20140090881 - SHIN; Yee Na ; et al.	2014-04-03
Semiconductor package and method of manufacturing the same Grant 8,450,844 - Shin , et al. May 28, 2	2013-05-28
Electronic Component Embedded Printed Circuit Board And Method Of Manufacturing The Same App 20130027896 - LEE; Seung Eun ; et al.	2013-01-31
Method of manufacturing PCB having electronic components embedded therein App 20120017435 - Sohn; Seung Hyun ; et al.	2012-01-26
Semiconductor package and method of manufacturing the same App 20110163437 - Shin; Yee Na ; et al.	2011-07-07
Electronic Component-embedded Printed Circuit Board And Method Of Manufacturing The Same App 20110164391 - SHIN; Yee Na ; et al.	2011-07-07
PCB having electronic components embedded therein and method of manufacturing the same App 20090277673 - Sohn; Seung Hyun ; et al.	2009-11-12
Semiconductor memory package App 20090057860 - Bae; Seok ; et al.	2009-03-05
Capacitor and multi-layer board embedding the capacitor App 20080158777 - Sohn; Seung Hyun ; et al.	2008-07-03

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