Shin; Won Sun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shin; Won Sun.The latest application filed is for "system for different bond pads in an integrated circuit package".

Company Profile

0.16.8

Shin; Won Sun - Suwon KR
Shin; Won Sun - Kyunggi-do KR
Shin; Won Sun - Kyungki-do KR
Shin; Won Sun - Singapore SG
Shin; Won Sun - Namyangju KR
Shin, Won Sun - Suwon-City KR
Shin, Won Sun - Namyangju-city KR
Shin; Won Sun - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
System for different bond pads in an integrated circuit package Grant 7,443,039 - Zhao , et al. October 28, 2	2008-10-28
Semiconductor package and method for fabricating the same Grant RE40,112 - Shin , et al. February 26, 2	2008-02-26
System for fabricating an integrated circuit package on a printed circuit board Grant 7,306,133 - Jin , et al. December 11, 2	2007-12-11
Thin semiconductor package including stacked dies Grant 7,211,900 - Shin , et al. May 1, 2	2007-05-01
Semiconductor package and method for fabricating the same Grant 7,190,071 - Shin , et al. March 13, 2	2007-03-13
System For Different Bond Pads In An Integrated Circuit Package App 20060197223 - Zhao; Lun ; et al.	2006-09-07
Method of manufacturing different bond pads on the same substrate of an integrated circuit package Grant 7,005,370 - Zhao , et al. February 28, 2	2006-02-28
Semiconductor package and method for fabricating the same Grant 6,982,488 - Shin , et al. January 3, 2	2006-01-03
Method Of Manufacturing Different Bond Pads On The Same Substrate Of An Integrated Circuit Package App 20050253262 - Zhao, Lun ; et al.	2005-11-17
Semiconductor package and method for fabricating the same App 20050205979 - Shin, Won Sun ; et al.	2005-09-22
Torch bump Grant 6,940,169 - Jin , et al. September 6, 2	2005-09-06
System for fabricating an integrated circuit package on a printed circuit board App 20040211817 - Jin, Yonggang ; et al.	2004-10-28
Semiconductor package and method for fabricating the same Grant 6,798,049 - Shin , et al. September 28, 2	2004-09-28
Torch Bump App 20040178503 - Jin, Yong Gang ; et al.	2004-09-16
Semiconductor package and method for fabricating the same App 20040164411 - Shin, Won Sun ; et al.	2004-08-26
Method of forming a small pitch torch bump for mounting high-performance flip-flop devices Grant 6,740,577 - Jin , et al. May 25, 2	2004-05-25
Semiconductor package and method for fabricating the same Grant 6,717,248 - Shin , et al. April 6, 2	2004-04-06
Semiconductor package and method for fabricating the smae App 20040007771 - Shin, Won Sun ; et al.	2004-01-15
Semiconductor package and method for fabricating the same App 20030100142 - Shin, Won Sun ; et al.	2003-05-29
Semiconductor package and method for fabricating the same Grant 6,515,356 - Shin , et al. February 4, 2	2003-02-04
Grid array type lead frame having lead ends in different planes Grant 6,150,709 - Shin , et al. November 21, 2	2000-11-21
Semiconductor package including heat sink with layered conductive plate and non-conductive tape bonding to leads Grant 5,854,511 - Shin , et al. December 29, 1	1998-12-29
Method for fabricating a heat sink-integrated semiconductor package Grant 5,807,768 - Shin September 15, 1	1998-09-15
Semiconductor lead frame having connection bar and guide rings Grant 5,723,899 - Shin March 3, 1	1998-03-03

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