Shin; Ung Hui
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shin; Ung Hui.The latest application filed is for "semiconductor chip".
- Shin; Ung Hui - Suwon-Si KR
| Patent | Date |
|---|---|
| Fan-out semiconductor package Grant 10,515,916 - Byun , et al. Dec | 2019-12-24 |
| Semiconductor Chip App 20190385956 - SHIN; Ung Hui ; et al. | 2019-12-19 |
| Printed circuit board Grant 10,448,512 - Lee , et al. Oc | 2019-10-15 |
| Fan-out semiconductor package Grant 10,157,868 - Byun , et al. Dec | 2018-12-18 |
| Fan-out Semiconductor Package App 20180308815 - Byun; Dae Jung ; et al. | 2018-10-25 |
| Electronic Component Package And Method Of Manufacturing The Same App 20180138127 - LEE; Doo Hwan ; et al. | 2018-05-17 |
| Electronic component package and method of manufacturing the same Grant 9,929,100 - Lee , et al. March 27, 2 | 2018-03-27 |
| Fan-out Semiconductor Package App 20180061795 - BYUN; Dae Jung ; et al. | 2018-03-01 |
| Electronic Component Package And Method Of Manufacturing The Same App 20160307847 - LEE; Doo Hwan ; et al. | 2016-10-20 |
| Semiconductor Chip App 20160276292 - Shin; Ung Hui ; et al. | 2016-09-22 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20160270232 - KIM; Jong Rip ; et al. | 2016-09-15 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20160219711 - LEE; Doo Hwan ; et al. | 2016-07-28 |
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